Bluetooth - Embedded Technology Deal Finalized: NewLogic Technologies and Hyperstone Sign Technology Agreement
Nürnberg, Germany, Embedded World - February 18th, 2003 - NewLogic Technologies, a leading supplier of intellectual property (IP) cores for wireless technology and Hyperstone, a fabless semiconductor and microprocessor design company, today announced that they have signed a technology agreement based upon their wireless and embedded RISC/DSP technology.
The agreement grants each company rights to certain technologies owned by the other. This will help NewLogic and Hyperstone to incorporate important new features and technologies into their products that are currently being requested by today's customers and so help each company to maintain and extend their current market leadership position.
Hyperstone is licensing NewLogic's revolutionary BOOST Core, BOOST Software and BOOST Radio for integration in their microprocessor based product line, which are used for applications in the consumer market e.g. flash memory cards, digital cameras, portable media devices and others.
The BOOST IP family includes a Bluetooth baseband processor, a full Bluetooth software protocol stack and a Bluetooth CMOS radio. These IP elements, when combined with a suitable microprocessor core, permit the implementation of a single chip Bluetooth solution using industry standard CMOS process technologies.
NewLogic is licensing Hyperstone's E1-32 single-core RISC/DSP architecture for integration in its wireless platform. The E1-32 microprocessor represents a new class of microprocessor, combining a high-performance RISC processor with an additional powerful DSP instruction set and on-chip microcontroller functions.
The E1-32 microprocessor makes the use of additional DSP chips or DSP cores obsolete. Up to now many multimedia, telecom or wireless designs required separate DSP's and a CPU. However, the E1-32 is ideal for these applications as the DSP unit is already integrated into the architecture.
"We are glad to announce Hyperstone as our latest Bluetooth licensee, said Hans Peter Metzler, President & CEO of NewLogic. "It's good to know that a recognized leader in embedded control chose NewLogic because of our low power and high density BOOST product technology."
"We see a lot of potential of Bluetooth technology for Hyperstone's product mix and for the benefit of our customers. It is also clear for us that both companies have complementary technologies, so it makes sense to cooperate to ensure we each provide the cost effective, leading edge technology required by our respective markets, said Dr. Matthias Steck, VP Sales & Marketing at Hyperstone.
About Hyperstone AG
Hyperstone AG is a fab-less microprocessor design company, founded in 1990, based in Konstanz, Germany. Staff members have up to 30 years experience in design, production, sales and marketing of computer systems and peripheral devices. Technical development takes place in Germany and Taiwan with sales channels operating through Hyperstone's global network of distributors and representatives (US, Europe, Taiwan, Korea, Japan), serving customers worldwide.
About NewLogic Technologies
NewLogic Technologies, headquartered in Lustenau, Austria, is a leading global supplier of Bluetooth and 802.11 Wireless LAN intellectual property cores as well as IC design services. In addition NewLogic offers IP integration services to help its customers achieve their aggressive time to market goals.
All Trademarks are the property of their respective owners. Bluetooth is a trademark owned by the Bluetooth SIG, Inc. and licensed to NewLogic.
|
Related News
- Altera and Intilop sign an agreement to offer intilop's UDP/TCP & EMAC IP cores embedded with OpenCL development Kit for end users and developers
- Rambus and NVIDIA Sign Patent License Agreement
- SST And Freescale Semiconductor Sign Embedded Flash Licensing Agreement
- Aplus and Flextronics Semiconductor Sign Licensing Agreement for Embedded EEPROM
- Ericsson Technology Licensing and NEC sign Bluetooth agreement
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |