MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences

MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility

HSINCHU, Taiwan – January 20, 2021 – MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences. The addition of the 6nm Dimensity 1200 and 1100 chipsets to MediaTek’s 5G portfolio gives device makers a growing suite of options to design highly capable 5G smartphones with top of the line camera features, graphics, connectivity enhancements and more.

"MediaTek continues to expand its 5G portfolio with highly integrated solutions for a range of devices from the high-end to the mid-tier,” said JC Hsu, Corporate Vice President and General Manager of MediaTek’s Wireless Communications Business Unit. “Our new Dimensity 1200 stands out with its impressive 200MP camera support and advanced AI capabilities, in addition to its innovative connectivity, display, audio and gaming enhancements.”

Key features of MediaTek Dimensity 1200 and 1100 5G chipsets include:

• The Most Out of 5G Every Day: The Dimensity 1200 and 1100 pack a highly integrated 5G modem with MediaTek’s 5G UltraSave technology for big power savings. Both chipsets support every connectivity generation from 2G to 5G, in addition to supporting the latest connectivity features including 5G standalone and non-standalone architectures, 5G carrier aggregation (2CC) across frequency division duplex (FDD) and time division duplex (TDD), dynamic spectrum sharing (DSS), True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR). The chipsets also integrate 5G HSR Mode and 5G Elevator Mode enhancements to ensure a seamless, reliable 5G connection across networks.
• Flagship AI Multimedia: The Dimensity 1200 supports 200MP photos for stunning photography with its five-core HDR-ISP. It boasts staggered 4K HDR video capture for significantly greater dynamic range. The chipset integrates an updated version of MediaTek’s hexa-core AI processor (MediaTek APU 3.0), which has an enhanced multi-task scheduler that reduces latency and improves power-efficiency. The Dimensity 1100 also packs impressive camera capabilities with its 108MP camera support, and integrates MediaTek’s existing APU 3.0 for high performance computing that’s also super power-efficient. Both chipsets support AI camera features including AI-Panorama Night Shot, AI Multi-Person Bokeh, AI noise reduction (AINR) and HDR capabilities. The chipsets also support new AI-enhanced video playback features including AI SDR-to-HDR.
• Premium Performance: The Dimensity 1200 has an octa-core CPU designed with an ultra-core Arm Cortex-A78 clocked up to 3GHz for extreme performance, three Arm Cortex-A78 super cores and four Arm Cortex-A55 efficiency cores. With a nine-core GPU and six-core MediaTek APU 3.0, the Dimensity 1200 delivers a new level of premium performance. The Dimensity 1100 is designed with an octa-core CPU which includes four Arm Cortex-A78 cores operating at up to 2.6GHz and four Arm Cortex-A55 efficiency cores, along with a nine-core Arm Mali-G77 GPU. Both chipsets are manufactured on TSMC’s advanced 6nm process technology.
• Incredible Displays: The Dimensity 1200 supports ultra-fast 168Hz refresh rates for a fast, fluid user experience. The Dimensity 1100 also supports cutting-edge displays with 144Hz refresh rates for ultra-sharp, zero-lag visuals. Both chipsets support MediaTek’s HyperEngine 3.0 gaming technologies, which includes 5G call and data concurrency for more reliable connectivity, plus multi-touch boost touchscreen responsiveness. The new chipsets also support ray tracing in mobile games and artificial reality applications for more realistic visuals, along with super hotspot power savings which let users go longer in between charges.
• Dual-Link True Wireless Stereo Audio: Dimensity 1200 and 1100 both support Bluetooth 5.2, which lets users stream to multiple wireless devices simultaneously. The chipsets also support ultra-low latency true wireless stereo audio and LC3 encoding for higher quality, lower latency streaming audio that’s also very power-efficient to prolong the battery life of wireless earbuds.

Dimensity 1200 has already received TÜV Rheinland certification for its 5G performance, with tests covering 72 real-world scenarios. The certification verifies that the chipset provides reliable, high-performance 5G connectivity and offers users high-quality 5G experiences across a wide variety of scenarios.

Many OEMs, including Xiaomi, Vivo, OPPO and realme, expressed support for MediaTek’s new Dimensity chip. The first devices with the new MediaTek Dimensity 1200 and 1100 chipsets are expected to hit the market at the end of Q1 and beginning of Q2 this year.

Other industry collaborators and supporters of the new MediaTek 5G chipsets include Arm, China Mobile, Tetras.AI, ArcSoft and Tencent Games.

For full specifications and further details on MediaTek Dimensity 1200 and 1100, please visit: https://i.mediatek.com/mediatek-5g

About MediaTek Inc.

MediaTek Incorporated (TWSE: 2454) is a global fabless semiconductor company that enables nearly 2 billion connected devices a year. We are a market leader in developing innovative systems-on-chip (SoC) for mobile device, home entertainment, connectivity and IoT products. Our dedication to innovation has positioned us as a driving market force in several key technology areas, including highly power-efficient mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, Voice Assistant Devices (VAD) and wearables. MediaTek empowers and inspires people to expand their horizons and achieve their goals through smart technology, more easily and efficiently than ever before. We work with the brands you love to make great technology accessible to everyone, and it drives everything we do. Visit www.mediatek.com for more information.