eInfochips Wins Design Services Company of the Year Award from IESA
The 2020 IESA Technovation award recognizes eInfochips' electronics and semiconductor design expertise
SAN JOSE, Calif., Jan. 22, 2021 -- eInfochips, a leading provider of product engineering and semiconductor design services, has won the Design Services Company of the Year award for 2020 from Indian Electronics and Semiconductor Association (IESA).
IESA is the premier industry body representing the Electronics & Semiconductor Design and Manufacturing (ESDM) industry in India. IESA aims to grow the ESDM industry in India to make it the preferred destination for ESDM business.
Every year, IESA recognizes top companies and individuals in the industry through their Technovation Awards. It has two broad segments for companies - products (fabless companies, OEMs) and services (design services, manufacturing services). In each segment, there are four categories – start-up, micro, small and medium enterprise (MSME), enterprise (companies with more than INR500 crores of annual revenue) and incubator.
eInfochips was recognized under the design services segment and enterprise category. All the nominations were thoroughly evaluated by an eminent jury comprising leaders from the industry, government, and academia. The jury assessed leading service providers in the market based on depth and maturity of services, innovation and intellectual property, eco-system linkages, and client engagements.
"This award is a strong reflection of our electronics and semiconductor design capabilities. It also reaffirms our reputation as one of the leading product engineering firms with solid semiconductor industry connect," said Saurabh Desai, vice president and general manager of ASIC division, eInfochips. "Our 25-plus years of experience in the silicon engineering value chain from design to verification, and continuous investment in acquiring new capabilities help us stay ahead of the curve and deliver better outcomes for our clients."
"Congratulations to the eInfochips team for winning this award. eInfochips has a strong legacy of more than two decades in electronics and silicon engineering services. Over the last few years, the firm has made significant strides in turnkey electronic product design and manufacturing as well. My best wishes for their continued growth in the ESDM sector," said Dr. Satya Gupta, chairperson, IESA.
About eInfochips
With 25-plus years of experience in the semiconductor industry, eInfochips has expertise in developing Verification IPs, custom ASICs, SoCs, and FPGAs, and has strong knowledge of Ethernet, PCI Express, CXL, HBM, LPDDR5, NVMe, eMMC, and USB protocols to name a few. With 200-plus tape-outs, eInfochips has expertise in dealing with digital and mixed signal SoCs. eInfochips works with six of the top 10 semiconductor companies worldwide and has been recognized as a leader in semiconductor design services by many top analysts and industry bodies, including Gartner, Zinnov, Nasscom and others.
|
Related News
- Ceva-NeuPro-Nano Wins Product of the Year Award at Prestigious EE Awards Asia Event
- Alphawave Semi Wins Fifth Consecutive TSMC OIP Ecosystem Forum Partner of the Year Award
- Arteris Wins Autonomous Vehicle Technology of the Year Award
- Arteris Wins Gold Stevie® Award in the 2023 International Business Awards® for Technical Innovation of the Year
- eMemory Wins 2019 TSMC IP Partner of the Year Award
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |