This is How Intel Gets Out of Manufacturing
It won’t be easy, but it could be done
By Jim McGregor, Tirias Research
EETimes (February 2, 2021)
On the heels of activist hedge fund Third Point calling on Intel’s board to explore “strategic alternatives,” like spinning off its fabs and/or divesting itself of unsuccessful acquisitions, Intel’s board reacted with a rapid change of CEOs, tapping Pat Gelsinger to succeed Bob Swan. However, in his first address to the financial community, Gelsinger committed Intel to remaining an integrated design manufacturer (IDM) — and, yes, that might require outsourcing some manufacturing to third-party fabs in the near term. While this may not please some investors, it is the correct decision at this time. However, I have a theory on how a spinoff could be successful, theoretically, in the long-term, say five years or more down the road
E-mail This Article | Printer-Friendly Page |
Related News
- Intel and AWS Expand Strategic Collaboration, Helping Advance U.S.-Based Chip Manufacturing
- Intel signs 7 out of top 10 fabless companies, sees 18A test chip
- How Investments in Manufacturing will Benefit the Semiconductor Ecosystem
- PathPartner Collaborates with Intel to Deliver AI-based Weld Defect Detection to the Manufacturing Industry
- Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards