7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
STMicro won't use ARM's 3-D core in Nomadik processor
![]() |
STMicro won't use ARM's 3-D core in Nomadik processor
By Junko Yoshida, EE Times
February 21, 2003 (12:00 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030221S0026
CANNES, France In a move other chip makers call surprising, STMicroelectronics will not use ARM Ltd.'s 3-D graphics hardware acceleration core in its new Nomadik application processor platform.
"We will be shortly announcing a technology partner" to add a 3-D graphics hardware acceleration core to Nomadik, said Marco Rossi, ST's marketing manager for Nomadik, a processor based on an ARM 32-bit RISC core. 3-D hardware acceleration "must be done in a very power-efficient manner," Rossi said Thursday (Feb. 20) at the 3GSM World Congress, so ST is taking a graphics path independent of ARM's MBX graphics core.
ST's decision is surprising not only because Nomadik uses the ARM926EJ-S processor core, but because of the close relationship between ST and ARM. ST developed Nomadik after licensing ARM's PrimeXsys platform, thereby gaining access to RTL code describing the peripherals, driver source code and tools. Such access allows a lic ensee to extend the platform, according to ARM.
ARM has been pushing to expand the PrimeXsys community by offering a number of hardware and software intellectual property cores all proven to work well with ARM processors, ARM said.
Integrating such cores is considered "low-risk," but ST has decided to innovate its 3-D graphics solution with another technology partner in hopes of maximizing the performance and lowering the power consumption of its Nomadik application processor.
Dae-Hyun Lee, manager of product planning at Samsung Electronics Co. Ltd., said his company is still in the process of selecting a 3-D graphics partner and hardware acceleration architecture for Samsung's ARM-based application processor, the S3C2410.
Related News
- First 3-D processor runs at 1.4 Ghz on new architecture
- Xilinx Demonstrates Industry's First Scalable 3-D Graphics Hardware Accelerator for Automotive Applications
- Xilinx And Pixel Velocity Team To Deliver World's Most Advanced 3-D Recognition Technology
- Renesas Technology Releases "OpenGL ES Library" 3-D Graphics Software for SH-Mobile3 Application Processor
- Xilinx Virtex-II Pro FPGAs Enable Pandora's Newest 3-D Colour Cube
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |