BLE/15.4 2.4GHz+Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP for adding wireless Connectivity to "any MCU/SoC"
May 3, 2021 -- T2M-IP, the global independent Semiconductor IP Cores, SW & Technology provider, is pleased to announce the availability of a BLE/15.4 2.4GHz + Sub-GHz Multi-Protocol RF Transceiver Phy KGD & IP based on 40nm ULP technology for custom system-in-package (SiP) or multi-chip package (MCP) solutions, or SoC development, instantly adding “Wireless connectivity” to any SoC with an embedded CPU.
This is a highly integrated KGD (Known Good Die), consisting of a mass production BLE/15.4 2.4GHz & Sub-GHz RF Transceiver Phy, for stacking inside a larger SoC package or external SoC (packaged device) on the pcb. The Protocol Stack SW, Profiles & Applications run on the host CPU, controlling the RF Transceiver Phy via an SPI interface to instantly deliver certified BLE/15.4/900-169MHz connectivity, without the cost and complexity of integration the RF onto the SoC die.
The Bluetooth LE & 15.4 Protocol Stack and Profiles SW provided have an extremely small Ram/Rom/MIPs footprints. The minimum CPU performance requirement is an ARM® Cortex M0@24MHz or equivalent. This enables any SoC with an embedded CPU with some free capacity to easily add Bluetooth/15.4 connectivity instantly.
Integrating complex RF into an SoC is high cost, high risk and time consuming. This RF Transceiver Phy KGD enables companies to add RF connectivity to any SoC instantly, independent of Foundry & Process node, very quickly and at a very low cost. This RF Transceiver Phy enables any SoC from a simple Microcontroller to a highly complex TV, STB, Mobile, IoT, Lighting, Medical, Audio, etc. SoC to integrate Bluetooth, ZigBee, RF4CE, 15.4 & other RF connectivity instantly.
T2M also has a BLE/15.4 2.4GHz only RF Transceiver Phy KGD based on the same design, as well as a complete range of related services including KGD integration, SW Integration, SIP Design, Packaging to Board Support Package, Product validation & Testing, Embedded SW, Application development, etc., customers will have a one-stop-shop solution.
Availability: For more information on pricing, availability and licensing options please drop a request to contact.
About: T2M-IP is the global independent semiconductor technology provider, supplying complex Semiconductor IP Cores, software, KGD and disruptive technologies enabling accelerated production of Wireless, Audio, IoT and Consumer SoCs.
|
T2M Hot IP
- Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP
- GNSS Ultra low power (GPS, Galileo, GLONASS, Beidou3, QZSS, IRNSS, SBAS) Digital ...
- USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP, Silicon Proven in TSMC 28HPC+
- DVB-S2X WideBand Demodulator & Decoder IP (Silicon Proven)
- MIPI D-PHY Tx IP, Silicon Proven in TSMC 22ULP
Related News
- Bluetooth RF Transceiver Phy KGD for adding Bluetooth Connectivity to "any SoC"
- Wi-Fi ax + BLE v5.3 + 15.4, 2.4GHz RF Transceiver IP core in 22nm, licensed to a Chinese customer for IoT chipset
- Wi-Fi 802.11 ax + Bluetooth LE v5.3 + 15.4 2.4GHz RF Transceiver IP Core in 22nm ULL, available for immediate licensing for IoT applications.
- Ceva multi-protocol wireless IP could simplify IoT MCU and SoC development
- Wi-Fi 6 (ax)/BLE/15.4 22nm Combo RF IP Core, for IoT Application is Available for Immediate Licensing
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |