TSMC's Chip Scaling Efforts Reach Crossroads at 2nm
By Alan Patterson, EETimes (June 7, 2021)
Perpetuating Moore’s Law — the observation that the transistor density in a typical chip doubles every two years — poses a number of challenges at the 3nm node, yet Taiwan Semiconductor Manufacturing Corp. (TSMC) remains optimistic.
There are many predictions Moore’s Law is likely to hit a wall soon, but “how soon?” is open to debate. Also, there are technologies that promise ongoing increases in performance that are not dependent on doubling transistor density. The timing of all that will have far-reaching implications. At last week’s TSMC 2021 Technology Symposium, TSMC CEO C. C. Wei gave the example of data centers, which consume over one percent of global electricity generated.
“Estimates suggest global electricity usage from data centers is projected to grow from five to forty times between 2010 to 2030. Why do projections vary so widely?” Wei asked. “Divergent estimates are partly due to the difficulty of making an accurate projection of our footprint. There are too many variables to consider, including whether Moore’s Law can continue.”
E-mail This Article | Printer-Friendly Page |
Related News
- TSMC's R&D chief sees 10 years of scaling
- Secure-IC's worldwide leading safe & secure automotive solutions achieve a new breakthrough: Securyzr™ S700 neo series reach ASIL-D grade
- Intel, TSMC to detail 2nm processes at IEDM
- Unveiling the Availability of Industry's First Silicon-Proven 3nm, 24Gbps UCIe™ IP Subsystem with TSMC CoWoS® Technology
- Silicon Creations Awarded TSMC's 2024 Open Innovation Platform Partner of the Year for Mixed Signal IP
Breaking News
- Baya Systems Raises $36M+ to Propel AI and Chiplet Innovation
- Andes Technology D45-SE Processor Achieves ISO 26262 ASIL-D Certification for Functional Safety
- VeriSilicon and Innobase collaboratively launched second-generation Yunbao series 5G RedCap/4G LTE dual-mode modem IP
- ARM boost in $100bn Stargate data centre project
- MediaTek Adopts AI-Driven Cadence Virtuoso Studio and Spectre Simulation on NVIDIA Accelerated Computing Platform for 2nm Designs
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Arm Chiplet System Architecture Makes New Strides in Accelerating the Evolution of Silicon
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X