Arteris IP FlexNoC Interconnect Again Licensed by AutoChips for Automotive SoC Product Line
Automotive semiconductor innovator standardizes on Arteris IP FlexNoC interconnect for use in its next-generation systems-on-chip.
CAMPBELL, Calif. – June 29, 2021 – Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in system-on-chip (SoC) semiconductor devices, today announced that Chinese automotive semiconductor vendor AutoChips has again licensed FlexNoC interconnect IP for use in automotive systems-on-chip (SoCs).
Related |
FlexNoC 5 Network-on-Chip (NoC) |
AutoChips first licensed Arteris IP semiconductor IP in 2018 and has implemented the technology in a production automotive chip design. (See, “Arteris IP FlexNoC® Interconnect Licensed by AutoChips for Automotive SoC Development.”)
“Arteris FlexNoC IP has been critical to our ability to quickly design and qualify our chips for the automotive market,” said Cliff Gu, chief designer at AutoChips. “Arteris IP has unparalleled technology that meets the unique functional safety, performance and time to market needs of our rapidly evolving automotive semiconductor market. In addition to offering unique on-chip interconnect IP with a strong track record of mass production automotive designs, the local Arteris IP engineering support team’s expertise in semiconductor architecture and design has provided added benefits to our company.”
“We are excited that AutoChips has renewed their use of Arteris IP interconnect technology as the on-chip communications backbone of its automotive systems-on-chip,” said K. Charles Janac, president and CEO of Arteris IP. “AutoChips’ decision to standardize on our interconnect IP for their automotive SoC portfolio is a strong endorsement of the benefits we bring to automotive semiconductor design teams.”
About AutoChips
AutoChips Inc. is the China leading Automotive IC company, which is a wholly-owned subsidiary of NavInfo. AutoChips’ head office is based in Hefei, responsible for designing and developing, and has three branch offices located in Shenzhen, Shanghai and Wuhan.
AutoChips is engaged in research and SoC design of automotive electronics, and is awarded the qualifications of “National Hi-Tech company” and “National IC design company”. AutoChips first-class engineering and service make it the leading position in the China after-market. Its products are widely used by Tier 1 customers and automotive manufacturers.
About Arteris IP
Arteris IP provides network-on-chip (NoC) interconnect IP and IP deployment technology to accelerate system-on-chip (SoC) semiconductor development and integration for a wide range of applications from AI to automobiles, mobile phones, IoT, cameras, SSD controllers, and servers for customers such as Bosch, Baidu, Mobileye, Samsung, Toshiba and NXP. Arteris IP products include the Ncore® cache coherent and FlexNoC® non-coherent interconnect IP, the CodaCache® standalone last level cache, and optional Resilience Package (ISO 26262 functional safety), FlexNoC AI Package, and PIANO® automated timing closure capabilities. Customer results obtained by using Arteris IP products include lower power, higher performance, more efficient design reuse and faster SoC development, leading to lower development and production costs. For more information, visit www.arteris.com
|
Arteris Hot IP
Related News
- Arteris IP FlexNoC Interconnect & Resilience Package Again Licensed by Black Sesame for ISO 26262-Compliant Automotive ADAS Chips
- Arteris IP FlexNoC Interconnect Licensed by AutoChips for Automotive SoC Development
- Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications
- Arteris IP FlexNoC Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC
- Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |