Is TSMC-Sony A Sign Of Things To Come?
One wonders if TSMC’s plan to build a 28nm 40k wpm fab in Japan to make image sensors for Sony is a sign of things to come.
One normally thinks of a new TSMC fab as being a bleeding edge, industry-leading facility but TSMC has been building trailing edge plants in China for years.
This is however, the first time it has built a fab for one customer and one product.
Sony has a $7 billion+ revenue business in image sensors which makes the $2.5 billion cost of such a fab a reasonable proposition,
E-mail This Article | Printer-Friendly Page |
Related News
- Codasip and RED Semiconductor Sign Memorandum of Understanding to Develop AI Acceleration Technologies
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
- CMC Microsystems and AIoT Canada Sign Memorandum of Understanding to support IoT and semiconductor ecosystem growth in Canada
- Brazil and Europe sign innovative project with RISC-V technology for HPC
- Qualitas Semiconductor and Ambarella Sign Licensing Agreement
Breaking News
- Rambus Reports Fourth Quarter and Fiscal Year 2024 Financial Results
- CoMira Solutions unveils its new 1.6T Ethernet UMAC IP
- intoPIX Unveils Cutting-Edge AV Innovations at ISE 2025
- RISC-V in Space Workshop 2025 in Gothenburg
- Dolphin Semiconductor strengthens its governance with two key Board appointments
Most Popular
- Intel Halts Products, Slows Roadmap in Years-Long Turnaround
- UK Space Agency Awards EnSilica £10.38m for Satellite Broadband Terminal Chips
- EXTOLL collaborates with BeammWave and GlobalFoundries as a Key SerDes IP Partner for Lowest Power High-Speed ASIC
- RaiderChip unveils its fully Hardware-Based Generative AI Accelerator: The GenAI NPU
- Celestial AI Announces Appointment of Semiconductor Industry Icon Lip-Bu Tan to Board of Directors