Chips&Media Announces 1 billion Cumulative Shipments of Multimedia IP
Seoul, South Korea – August 09, 2021 – Chips & Media, a semiconductor hardware intellectual property (IP) provider targeting multimedia, today reported its remarkable record of 1 billion cumulative shipments containing its multimedia IPs. Chips&Media’s advanced IPs are embedded in various SoC applications, including automotive, AI servers, set-top boxes (STBs), surveillance cameras, digital TVs, intelligent cameras, robots, etc., and reached the cumulative shipments surpassing 1 billion units.
Chips&Media launched numerous video codec hardware IPs since its establishment in 2003. The expansion of the multimedia portfolio from video codec to image signal processing and deep learning-based computer vision HW IP has widen a range of applications for System-on-Chip (SoC) for it to be embedded. The extension of cutting-edge IP cores led Chips&Media to be recognized as a powerful, competitive video IP provider, offering comprehensive, customizable, and cost-efficient IPs for complex SoC designs. More than a hundred customers across the globe have adopted Chips&Media’s enhanced IP cores, including world-famous companies, and has witnessed a steady growth in the annual royalty revenue.
Although the COVID-19 outbreak has impacted the global economy, the SoC shipments with Chips&Media’s IPs gained opportunities as the IP camera and server industries have grown this year. Chips&Media is expecting earnings to increase compared to the previous year, based on its recent release of video encoder IP, WAVE627, supporting AV1, HEVC/H.265, and AVC/H.264 standards that can encode up to 4K60fps @500MHz, and the development demand is expected to recover from the pandemic.
About Chips&Media
Chips&Media is the leader in the semiconductor multimedia hardware IP for video codec, deep learning-based computer vision (super-resolution), and image signal processing. Chips&Media’s IPs had been licensed by over hundreds of customers, and acclaimed for low power usage, high-performance, small-size, reliability. The IP cores can be utilized in surveillance, automotive, and other consumer electronic industries. The company was founded in 2003 and headquartered in Seoul, South Korea, with offices worldwide.
Visit www.chipsnmedia.com for more information.
|
Chips&Media Hot IP
Related News
- Andes Technology Announces over 10 Billion Cumulative Shipments of Andes-Embedded SoCs and Records All-Time High Annual and Monthly Revenue in 2021
- Andes Technology Announces over 5 Billion Cumulative Shipments of SoCs Embedded with Its CPU IP since Company Inception
- Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception
- Andes Technology Records 1 Billion SoC Shipments in 2018 Based on Its CPU IP and 3.5 Billion Since Inception
- Andes Technology Corporation Records a Cumulative 2.5 Billion SoC Shipments Containing Its CPU IP Since Inception
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |