Xpeedic EDA Cloud Platform on Microsoft Azure
CUPERTINO, Calif.-- August 17, 2021 --Xpeedic today released its EDA Cloud Platform on Microsoft Azure at DesignCon 2021. DesignCon 2021 is taking place August 16-18 at the San Jose McEnery Convention Center in San Jose, CA.
EDA flow for design and verification of IC, package and system becomes more and more complex with advanced process nodes and advanced packaging, driven by high-performance computing applications such as 5G, artificial intelligence, autonomous driving, and edge computing.
Engineering simulation requires heavy investment in IT infrastructure with high performance server farms. Moreover, the demand for high performance computing resources is sometimes fluctuating and unpredictable due to ever decreasing design cycle time and time to market. Building IT infrastructure to cover the peak demand becomes not only challenging but also not economical. Xpeedic EDA Cloud Platform on Azure well addresses these issues and enables both scalability and agility required for performance-critical EDA workloads.
“Xpeedic provides EDA solution spanning from IC, packaging to system with its proprietary electromagnetic solver technologies. Microsoft Azure offers a secure, agile, and scalable platform with a comprehensive set of services and ecosystem integrated by many EDA, IP and foundries,” said Austin Wang, Cloud Solution Architect & Partner Technology Architect Lead. “The organic combination of the two will benefit mutual customers with the near infinite compute, memory, storage, and resource available in Azure, which can significantly reduce their cost and accelerate their time to market.”
“We are very happy to release Xpeedic EDA Cloud Platform on Microsoft Azure,” said Dr. Feng Ling, CEO of Xpeedic. “Xpeedic electromagnetic solver technologies support both multi-core parallelism and distributed computing, which makes them suitable for cloud computing. Xpeedic’s own job scheduler JobQueue can manage computing resources and prioritize the simulation jobs. With the near infinite resource available in Azure, Xpeedic can help users achieve scalability for their most demanding simulation jobs.”
About Xpeedic
Xpeedic is a leading provider of EDA/IP solutions to accelerate designs and simulations for next generation high-frequency, high-speed intelligent electronic products across chip, package and system levels, such as RF front end components and modules, high-speed interconnects, connectors, IC packages and printed circuit boards.
Customers span the worldwide semiconductor, computer, consumer electronics, and telecommunications markets and adopt Xpeedic solutions to streamline design process, improve end-product performance, and accelerate time to market.
|
Related News
- Cadence and Microsoft Collaborate to Facilitate Semiconductor and System Design on the Microsoft Azure Cloud Platform
- Synopsys, TSMC and Microsoft Azure Deliver Highly Scalable Timing Signoff Flow in the Cloud
- Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
- Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program to Enable Peakview EM Platform and Accelerate IC and 3DIC Designs
- Alibaba Cloud Unveils Chip Development Platform to Support Developers with RISC-V based High-performance SoCs
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |