English
Samsung to triple foundry capacity
By David Manners, ElectronicsWeekly (October 28, 2021)
Earlier today, Samsung said it plans to triple its foundry capacity by 2026.
“We plan to expand our capacity about three times by 2026 to meet customers’ needs as much as possible by expanding capacity in Pyeongtaek as well as considering establishing a new plant in the U.S.,” says Samsung’s Han Seung-hoo.
Han said that Samsung will be producing 3nm foundry chips in H1 2022 and expects to have a second generation 3nm process in 2023.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
|
||||||
Related News
- Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022
- Samsung Showcases AI-Era Vision and Latest Foundry Technologies at SFF 2024
- Synopsys and Samsung Electronics Collaborate to Achieve First Production Tapeout of Flagship Mobile CPU with Leading Performance on Samsung Foundry's GAA Process
- Samsung Electronics Collaborates With Arm on Optimized Next Gen Cortex-X CPU Using Samsung Foundry's Latest GAA Process Technology
- Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset