Worldwide Silicon Wafer Shipments Reach Record High in Third Quarter of 2021, SEMI Reports
MILPITAS, Calif. ─ November 4, 2021 ─ Worldwide silicon wafer shipments increased 3.3% to 3,649 million square inches in the third quarter of 2021 compared to the previous quarter, a new industry record, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry. Third-quarter 2021 silicon wafer shipments grew 16.4% from the 3,135 million square inches recorded during the same quarter last year.
Silicon Area Shipment Trends – Semiconductor Applications Only “Silicon wafer shipments reached a new high in third quarter, with higher shipments in all diameters, which support the large variety of semiconductor devices needed for the modern economy,” said Neil Weaver, Chairman of SEMI SMG and Vice President of Product Development and Applications Engineering at Shin Etsu Handotai America. “Silicon wafer demand is expected to remain high, as many new fabs will ramp up in the next several years.”
Millions of Square Inches
2Q 2020 | 3Q 2020 | 4Q 2020 | 1Q 2021 | 2Q 2021 | 3Q 2021 | |
Total | 3,152 | 3,135 | 3,200 | 3,337 | 3,534 | 3,649 |
Source: SEMI (www.semi.org), November 2021
Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.
Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronics including computers, telecommunications products, and consumer devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.
The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.
For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more.
|
Related News
- Silicon Wafer Shipments Reach New High in Second Quarter 2021, SEMI Reports
- Worldwide Silicon Wafer Shipments Set a New Record in Q3 2022, SEMI Reports
- Worldwide Silicon Wafer Shipments Edge Higher to New Record in First Quarter 2022, SEMI Reports
- Silicon Wafer Shipments Edge Higher in First Quarter 2021 to Set New Record, SEMI Reports
- Worldwide Silicon Wafer Shipments Fall in Q3 2023, SEMI Reports
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |