English
TSMC in spat with Intel
By David Manners, ElectronicsWeekly (December 7, 2021)
Last weekend TSMC chairman Mark Liu took Intel to task over its efforts to persuade the US government only to support domestic US chip companies.
’Not too many people will believe what Intel says,” said Liu, “it will be very negative for the US to subsidise only American companies. Unlike Intel, TSMC is very positive about non-US chipmskers expanding capacity in America. It is a great thing. This shows our decision two years ago is correct.”
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Intel to place US$14 billion orders with TSMC, says report
- Senators Seek Suspension of TSMC US Fab Project
- Politics Haunts TSMC's US Fab Plan
- Report: TSMC confirms U.S. wafer fab site hunt
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards