Real Wireless Research Shows One Third Reduction for Private Network Infrastructure Cost Using AccelerComm 5G physical layer IP solution
Industrial private networks see considerable infrastructure savings by deploying AccelerComm solutions
Southampton, UK - January 24, 2022 -- AccelerComm, the company supercharging 5G with a complete physical layer solution which increases spectral efficiency and reduces latency, today announced the findings of a report commissioned from Real Wireless, the independent wireless experts, which shows significant reductions in 5G Private network infrastructure costs by utilising AccelerComm’s 5G physical layer IP solution.
To get the full details of the research sign-up to a joint Webinar: 5G Private Networks: How maximising spectral efficiency can reduce infrastructure costs by a third and improve performance being hosted by Mobile World Live on February 1st at 10:00am ET/15:00 GMT.
“Private Networks are being increasingly widely deployed, in particular within vertical markets such as ports, factories and agriculture,” said Dr. Anastasios Karousos of Real Wireless. “However to be successful in these sectors, private networks must be delivered at a reasonable cost and provide increased efficiency and productivity.”
“Private networks are being used by the mobile industry as test-beds to rapidly deploy, trial and iterate on new technologies such as 5G and O-RAN. At the centre of this is the drive to make sure that 5G is delivered in a way which maximises ROI,” said Eric Dowek, Segment Marketing Director at AccelerComm. “This research from Real Wireless shows the clear benefits of our IP in helping to optimise infrastructure requirements and improve performance. It confirms that by adopting AccelerComm’s physical layer solution there are considerable benefits in infrastructure cost savings and performance, across a range of private and public network deployment scenarios.”
|
AccelerComm Limited Hot IP
Related News
- Lockheed Martin Prepares First 5G.MIL® Payload for Orbit
- AccelerComm Announces 5G IP with O-RAN Acceleration Abstraction Layer (AAL) Interface
- EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure
- AccelerComm Launches PUSCH Channel Simulator for 5G L1 Performance Evaluation
- AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |