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NexFlash signs foundry agreement with Winbond Corporation for flash memory production
• Advanced 0.18 micron Flash memory process
• NexFlash to produce new line of Serial Flash memories
SAN JOSE, CA - MARCH 19th, 2003 - NexFlash Technology, Inc. today announced it has signed a foundry agreement with Winbond Electronics Corporation of Taiwan. The agreement allows NexFlash to design and produce Flash memory products utilizing Winbond's advanced 0.18 micron "WinStack" Flash Memory process. NexFlash will introduce a new line of Serial Flash memories in the second half of 2003 to be manufactured at Winbond's fab.
"We are extremely pleased to have Winbond Electronics Corporation as our new foundry partner," said Thomas Liao, President and CEO of NexFlash Technologies, Inc. "Winbond's state-of-the-art manufacturing facilities enable NexFlash to mass-produce cost-effective and high-quality Serial Flash products".
Serial Flash memories are becoming a popular alternative to parallel Flash as a means to reduce ASIC and controller pin count, system board space, power, noise and overall cost. Serial Flash is well suited for code-download applications including graphics cards, disk drives, printers, DVDs, wireless LANs, ADSL and networking. They also work well for data, text and voice storage in most microcontroller-based systems.
About NexFlash
NexFlash Technologies, Inc. designs and markets Specialty Flash Memory Products for emerging applications. NexFlash was founded in October 1998, is headquartered in San Jose, CA, and is a partially owned subsidiary of Winbond Electronics Corporation. NexFlash holds numerous patents on its technology and has established strategic alliances with Sharp Corporation and Winbond Electronics Corporation. For more information please visit the NexFlash website at www.nexflash.com
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