Motorola Offers Packaged Wireless Network Interface Software to Speed Designs
DALLAS, Mar 24, 2003 -- Makers of Wireless Infrastructure Equipment Can Ease Migration from 2G to 3G with Motorola's Network Processors and Software. SMART NETWORKS DEVELOPER FORUM -- Motorola, Inc. (NYSE: MOT) today introduced a second generation of product- quality Smart Wireless Network Interface (WNI) software that runs on its network processors. This software is designed to enable customers to accelerate their development of wireless infrastructure equipment and more easily adapt their designs to an evolving and converging market.
WNI software can be used to build 2.5 and 3G wireless network interface line cards for Base Transceiver Stations (BTSs), NodeB devices, Base Station Controllers (BSCs), Radio Node Controllers (Rocs), and mobile switching centers. WNI software includes comprehensive data plane support for ATM (Asynchronous transfer mode.), IP (Internet Protocol), and TDM (time division multiplexing), as well as support for connection-based Quality of Service (QoS). In addition, WNI software incorporates host drivers, application programming interfaces (modeled after those under development by the Network Processor Forum), and control stack code to streamline data plane and control plane software integration.
"In a market as dynamic as the wireless infrastructure, having a flexible solution that enables you to get products to market faster and adapt your design to changing standards is critical," said Joe Lugo, vice president of Engineering, Artesyn Communication Products. "The combination of Motorola's network processors with the Wireless Network Interface software has provided a solid foundation on which to build our SpiderWare(TM) NP, giving us a jump start on our product design. Even more important, we will be able to address our customers' needs and market changes more efficiently through software upgradeable network interfaces."
The WNI software is designed to be scalable across Motorola's network processors so that you can reuse your software base in all levels of wireless infrastructure systems -- building software reliability along the way. For example, the WNI BTS (base transceiver site) application, running on the C-3e(TM) network processor, includes the functions for re-assembling low-speed voice and data connections for delivery to higher bandwidth packet and cell transports. The WNI BSC application, running on the C- 5e(TM) network processor, includes the functions for aggregating channelized interfaces to SONET/SDH transports for delivery to higher bandwidth nodes in the wireless infrastructure.
WNI software version 1.1 is scheduled to be released on March 27, 2003. It is designed to be compatible with C-Ware(TM) Software Toolset version 2.2, a mature software development kit for programming applications for Motorola's network processors. WNI version 1.1 builds on the earlier WNI release that has been shipping since September 2002. In addition to providing new features, WNI version 1.1 has also been tested and verified on the C-5e network processor hardware that is currently sampling to customers.
WNI software version 1.1 offers exceptional integration of wireless network functionality. ATM protocol support includes AAL- 1 Circuit Emulation Service (CES), AAL-2 Common Part Sublayer (CPS), AAL-2 Service Specific Segmentation and Reassembly (SSSAR), AAL-5, Inverse Multiplexing over ATM (IMA), and Traffic Management 4.1. IP protocol support includes IPv4, IPv6, IP header compression, DiffServ, Multi-link and Multi-class Point to Point Protocol (PPP), and PPP-Mux. Interfaces supported by the software include E1/T1/J1, 10/100 Ethernet, OC-3c/STM-1c ATM, and UTOPIA Level-2 ATM.
At the Smart Networks Developers Forum (SNDF), 2003, a presentation entitled 'Designing & Building Wireless Infrastructure Systems with the C-Port Family and PowerPC(R) ISA Host Processors' is scheduled to be held on Tuesday, March 25 at 9:00 AM. Also planned is a wireless Base Station Controller demonstration of WNI version 1.1 software shown in the SNDF Technology Lab.
About Motorola's Semiconductors Products Sector
As the world's #1 producer of embedded processors, Motorola's Semiconductor Products Sector creates DigitalDNA(TM) system-on- chip solutions for a connected world. Our strong focus on wireless communications and networking enables customers to develop smarter, simpler, safer and synchronized products for the person, work team, home and automobile. Motorola's worldwide semiconductor sales were $4.8 billion (USD) in 2002. For more information please visit www.motorola.com/semiconductors.
About Motorola, Inc.
Motorola, Inc. (NYSE: MOT) is a global leader in providing integrated communications and embedded electronic solutions. Sales in 2002 were $26.7 billion. Motorola is a global corporate citizen dedicated to ethical business practices and pioneering important technologies that make things smarter and life better for people, honored traditions that began when the company was founded 75 years ago this year. For more information, please visit: www.motorola.com
|
Related News
- Opulan Selects ARM High-Speed Physical Interface Solution For Next Generation Network SoC Designs
- Siemens simplifies development of AI accelerators for advanced system-on-chip designs with Catapult AI NN
- Intelop delivers industry's first customizable/scalable multi-port Network Switch + 1G/100 MB EMAC + Motorola CPU interface Silicon IP for industrial automation applications
- Wipro-NewLogics High Speed Interface Technology to Be Included in Microsoft Corporations Microsoft Auto Platform
- Sigma Designs Announces CoAir, the World's First Ultrawideband Chipset With Integrated Wireless, Coax and Gigabit Ethernet for High Speed Whole Home Networking
Breaking News
- Arm loses out in Qualcomm court case, wants a re-trial
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
Most Popular
E-mail This Article | Printer-Friendly Page |