7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
PCIe 6.0 Designed to Meet Automotive, AI Bandwidth Demands
Automotive, AI bandwidth demands push interconnect performance
By Gary Hilson, EETimes (March 14, 2022)
To meet the bandwidth demands of rapidly advancing automotive and artificial intelligence (AI) and machine learning (ML) workloads, companies such as Rambus are beginning to change where Peripheral Component Interconnect Express (PCIe) interconnects are getting used, effectively joining PCIe and CXL data planes to optimize interconnect performance.
There are probably few surprises to be found in the latest iteration of PCIe as many industry players contributed to its development — the PCIe special interest group (SIG) now boasts 900 members. PCIe has become somewhat ubiquitous in computing over the past two decades, enabling other mature and emerging standards such as Non-Volatile Memory Express (NVMe) and Compute Express Link (CXL).
Similar to its predecessors, PCIe 6.0 is aimed at data–intensive environments such as data centers, high–performance computing (HPC), AI and ML. But as the modern vehicle continues its evolution as a server on wheels — nay, a data center on wheels — many storage technologies are making the trip to automotive applications, including solid-state drives (SSDs) that use both NVMe and PCIe.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Alphawave Semi and InnoLight Collaborate to Demonstrate Low Latency Linear Pluggable Optics with PCIe 6.0® Subsystem Solution for High-Performance AI Infrastructure at OFC 2024
- Synopsys Launches Industry's First Complete 1.6T Ethernet IP Solution to Meet High Bandwidth Needs of AI and Hyperscale Data Center Chips
- PCIe Eyes Road Ahead with AI, Automotive
- Rambus Delivers PCIe 6.0 Interface Subsystem for High-Performance Data Center and AI SoCs
- Avery Design Partners with S2C to Bring PCIe 6.0 and LPDDR5 and HBM3 Speed Adapters to FPGA prototyping solutions for Data Center and AI/ML SoC Validation
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset