TSMC Board of Directors Meeting Resolutions
HSINCHU, Taiwan, R.O.C., May 10, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today held a meeting of the Board of Directors, which passed the following resolutions:
1. Approved the distribution of a NT$2.75 per share cash dividend for the first quarter of 2022, and set September 21, 2022 as the record date for common stock shareholders entitled to participate in this cash dividend distribution, and the ex-dividend date for the common shares shall be September 15, 2022. As required by Article 165 of Taiwan’s Company Law, the shareholders’ register shall be closed for five days prior to the record date (September 17 through September 21, 2022) for registration transfer, and the dividend will be paid on October 13, 2022. In addition, the ex-dividend date for TSMC American Depositary Shares (ADSs) will be September 15, 2022. The record date for TSMC ADSs entitled to participate in this cash dividend distribution will be September 16, 2022.
2. Approved capital appropriations of approximately US$16,757.67 million for purposes including: 1) Installation and upgrade of advanced technology capacity; 2) Installation of mature and specialty technology capacity; 3) Installation and upgrade of advanced packaging capacity; 4) capitalized leased assets.
3. Approved the Global Employee Stock Purchase Plan which applies to all regular employees of TSMC and its wholly owned subsidiaries.
|
Related News
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |