2023 IC market to fall 22%, says Penn
The semiconductor industry has passed the peak of the rollercoaster market cycle and is beginning its descent, said Malcolm Penn CEO of Future Horizons at IFS2022 in London yesterday.
By David Manners, ElectronicsWeekly (May 11, 2022)
Although 2022 won’t be a disaster, 2023 will be, said Penn.
This year the growth forecast is +6%. +10% is still possible, but so is +4%.
“The slowdown is inevitable, the magnitude of it depends on the timing,” said Penn, “unit shipments will plummet first then ASPs will collapse”
Next year the market goes negative, forecast Penn.
“The industry’s 17th downcycle fuse is already burning because of a collapsing chip market combined with a global economic downturn,” said Penn.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Global Top 10 IC Design Houses See 49% YoY Growth in 2024, NVIDIA Commands Half the Market, Says TrendForce
- Q2 Revenue for Top 10 Global IC Houses Surges by 12.5% as Q3 on Pace to Set New Record, Says TrendForce
- After Record Sales in 2022, Semi Sales Forecast to Fall -5% in 2023
- Delay in Mass Production of New Intel Products a Boon for AMD, Proportion of AMD x86 Server CPUs Forecast to Exceed 22% in 2023, Says TrendForce
- Global Top Ten IC Foundries Ranked for 1Q19, with TSMC Expected to Reach 48.1% Market Share, Says TrendForce
Breaking News
- Ceva Neural Processing Unit IP for Edge AI Selected by Nextchip for Next-Generation ADAS Solutions
- Cadence Advances AI in the Cloud with Industry-First DDR5 12.8Gbps MRDIMM Gen2 Memory IP System Solution
- Thalia joins GlobalFoundries' GlobalSolutions Ecosystem to advance IP reuse and design migration
- MosChip® to showcase Silicon Engineering Services at TSMC 2025 North America Technology Symposium
- Alphawave Semi Audited Results for the Year Ended 31 December 2024
Most Popular
- New Breakthroughs in China's RISC-V Chip Industry
- Cadence to Acquire Arm Artisan Foundation IP Business
- Analog Bits to Demonstrate IP Portfolio on TSMC 3nm and 2nm Processes at TSMC 2025 Technology Symposium
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- Shifting Sands in Silicon by Global Supply Chains