India Prepares to Build Nation's First Chip Fab
By Alan Patterson, EETimes (May 10, 2022)
India is edging toward the construction of its first IC fab in the southwestern state of Karnataka following ISMC’s recent announcement.
The project would invest about $3 billion in a 65–nm analog chip fab, according to a statement by India’s Next Orbit Ventures, a fund management firm that aims to kickstart the effort. Israel’s Tower Semiconductor said it will be a technology provider for the project.
“If and when this project should take place, Tower will be only an integrator and a technology partner,” Tower spokeswoman Shahar Orit told EE Times. Orit declined to provide details, citing Tower’s expected acquisition by Intel. Intel also declined to comment due to the acquisition of Tower having yet to be formally approved.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Tower bids to build 300-mm wafer fab in India
- TSMC in talks to build fab in Dresden
- India set for fab
- TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder
- GlobalFoundries Plans to Build New Fab in Upstate New York in Private-Public Partnership to Support U.S. Semiconductor Manufacturing
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset