ReRAM Proves Resistant To Invasive Attacks
Few-Time and One-Time Programmable Memory Applications Using ReRAM
SANTA CLARA, CA, May 20, 2022 - CrossBar Inc., a leading non-volatile memory technology provider, today announced new applications of its Resistive RAM (ReRAM) technology for use in secure storage and processing, where resistance to reverse engineering and physical attacks are essential requirements of the system.
While historically utilized as a high-performance, high-density multi-time programmable non-volatile memory, CrossBar’s Resistive RAM technology is now being offered for use in memory applications requiring higher levels of content security.
“The high-tech marketplace is demanding memory products with increased levels of memory security to counter anticipated physical attacks,” said Mark Davis, President of CrossBar, Inc. “Our filamentary based ReRAM has been demonstrated to provide unique levels of security, including strong resistance to attempts to read our memory through invasive physical hacking.”
“MSI performed extensive delayering and inspection of CrossBar’s ReRAM memory silicon through imaging techniques in an attempt to determine its stored content”, said Michael Strizich, President of MicroNet Solutions, Inc. “After significant evaluation using sophisticated techniques such as measuring electron beam induced current and passive voltage contrast imaging, we were unsuccessful in determining the contents of the memory array”.
ReRAM Cell Physical Intrusion Resistance
Due to its basic structure, CrossBar’s ReRAM cell itself is inherently resistant to physical hacking targeting sensitive information and data stored in memory. It is not feasible to externally read the physical ReRAM cell electrically, magnetically or through imaging techniques even after delamination of the silicon. Also, the ReRAM cell is fabricated vertically, is located between layers of metal, and has a very small cross-sectional area, making it virtually impossible to measure its resistance in attempts to determine its stored contents.
Compared to oxide based ReRAM, Crossbar’s ReRAM utilizes stochastic electro-chemical ionic movement that is more difficult to analyze or useful for inferring the contents of the ReRAM. The ReRAM-based cell microstructure changes are unclonable, and unlikely to be detected using invasive techniques such as FIB (Focused Ion Beam) or SEM (Scanning Electron Microscopy) or TEM (Transmission Electron Microscopy) sampling. For example, TEM images of two ReRAM cells holding data states of “1” or “0” show no differences in physical appearance between the storage cells. These features make the content generated in the ReRAM memory or physical unclonable function (PUF) physically untraceable.
CrossBar’s ReRAM technology is enabling a new class of computing and storage, addressing the needs of high-performance, high-density memories requiring increased levels of security such as finance and digital asset applications.
CrossBar Resources
About CrossBar, Inc.
CrossBar is the leader in ReRAM technology, enabling kilobytes to terabytes of always-on data storage to be embedded into any SoC or as a standalone memory chip. CrossBar ReRAM lets designers rethink the compute/storage paradigm, free from the constraints of traditional flash and DRAM memories. From “persistent memory” that brings data closer to the CPU, ReRAM is ushering in a new era of data storage and secure computing. For more information, visit www.crossbar-inc.com.
|
Related News
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |