7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
Cadence Completes Acquisition of Future Facilities
SAN JOSE, Calif.— July 15, 2022 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has completed the acquisition of Future Facilities. The addition of Future Facilities technologies and expertise supports the Cadence® Intelligent System Design™ strategy and broadens its multiphysics system analysis and computational fluid dynamics (CFD) portfolios. Future Facilities’ electronics cooling analysis and energy performance optimization solutions for data center design and operations using physics-based 3D digital twins enables leading technology companies to make informed business decisions about data center design, operations and lifecycle management and reduce their carbon footprint. Future Facilities’ proven technologies serve a wide breadth of hyperscale, enterprise data center, managed services and colocation providers, including Hewlett Packard Enterprise, Digital Realty, Equinix and Kao Data.
About Cadence
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For eight years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at www.cadence.com.
|
Cadence Hot IP
Related News
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |