7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
CXL Consortium Releases Compute Express Link 3.0 Specification to Expand Fabric Capabilities and Management
BEAVERTON, Ore.-- August 02, 2022 -- The CXL Consortium, an industry standards body dedicated to advancing Compute Express Link™ (CXL™) technology, today announced the release of the CXL 3.0 specification. The CXL 3.0 specification expands on previous technology generations to increase scalability and to optimize system level flows with advanced switching and fabric capabilities, efficient peer-to-peer communications, and fine-grained resource sharing across multiple compute domains.
“Modern datacenters require heterogenous and composable architectures to support compute intensive workloads for applications such as Artificial Intelligence and Machine Learning – and we continue to evolve CXL technology to meet industry requirements,” said Siamak Tavallaei, president, CXL Consortium. “Developed by our dedicated technical workgroup members, the CXL 3.0 specification will enable new usage models in composable disaggregated infrastructure.”
Highlights of the CXL 3.0 specification:
- Fabric capabilities
- Multi-headed and Fabric Attached Devices
- Enhanced Fabric Management
- Composable disaggregated infrastructure
- Better scalability and improved resource utilization
- Enhanced memory pooling
- Multi-level switching
- New enhanced coherency capabilities
- Improved software capabilities
- Doubles the bandwidth to 64GTs
- Zero added latency over CXL 2.0
- Full backward compatibility with CXL 2.0, CXL 1.1, and CXL 1.0
“CXL 3.0 is a significant step forward in enabling heterogeneous computing,” said Kevin Krewell, principal analyst, TIRIAS Research. “With its expanded features for coherent memory sharing and new fabric capabilities, CXL 3.0 adds new levels of flexibility and composability required by present day and future data centers. The CXL Consortium has made exceptionally fast progress in delivering this important spec to the industry.”
CXL Consortium Presentations at Flash Memory Summit (FMS)
The CXL Consortium will introduce the new CXL 3.0 features at FMS, taking place August 2-4 at the Santa Clara Convention Center. View the FMS agenda for detailed information on the CXL presentations.
To schedule a meeting with a CXL representative during FMS, contact press@computeexpresslink.org.
Resources:
About the CXL™ Consortium
The CXL Consortium is an industry standards body dedicated to advancing Compute Express Link™ (CXL™) technology. CXL is a high-speed interconnect offering coherency and memory semantics using high-bandwidth, low-latency connectivity between the host processor and devices such as accelerators, memory buffers, and smart I/O devices. For more information or to join, visit www.computeexpresslink.org.
|
Related News
- CXL Consortium Releases Compute Express Link 2.0 Specification
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- CXL Consortium Announces Compute Express Link 3.1 Specification Release
- CXL Consortium Showcases First Public Demonstrations of Compute Express Link Technology at SC21
- Compute Express Link Consortium (CXL) Officially Incorporates; Announces Expanded Board of Directors
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |