CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology
Leading standards organizations form a joint Work Group to exchange information, align future efforts, and reduce overlap between the two technologies
ARLINGTON, Va.-- August 25, 2022 --JEDEC Solid State Technology Association and Compute Express Link™(CXL™) Consortium today announced the signing of a Memorandum of Understanding (MOU) to formalize collaboration between the two organizations. The agreement outlines the formation of a joint work group to provide a forum that facilitates communication and sharing of information, requirements, recommendations and requests with the intent that this exchange of information will help standards developed by each organization augment one another.
“The MOU between JEDEC and CXL Consortium will establish a framework for ongoing communication to align future efforts between the two organizations. The joint work group will collaborate on useful solutions for form factors, management, security, and DRAM and other memory technologies,” said Siamak Tavallaei, CXL Consortium President.
“With support from dozens of industry-leading companies, this cooperation will assist both organizations in optimizing the development of our own respective standards and will support JEDEC in its current focus on creating select standards targeted for CXL-attached memory modules and components,” said Mian Quddus, JEDEC Chairman.
To participate in the joint Work Group, a company must be at the membership level of both organizations that binds them to the respective IPR policies. To join the CXL Consortium, visit https://www.computeexpresslink.org/join. To join JEDEC, visit https://www.jedec.org/join-jedec.
About the CXL™ Consortium
The CXL Consortium is an industry standards body dedicated to advancing Compute Express Link™ (CXL™) technology. CXL is a high-speed interconnect offering coherency and memory semantics using high-bandwidth, low-latency connectivity between the host processor and devices such as accelerators, memory buffers, and smart I/O devices. For more information or to join, visit www.computeexpresslink.org.
About JEDEC
JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 340 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit www.jedec.org.
|
Related News
- CXL Consortium and Gen-Z Consortium Announce MOU Agreement
- WiLAN and Several Subsidiaries Sign Comprehensive Semiconductor License Agreement with SK hynix
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
- ADTechnology and CoSignOn/CoreLink Sign MOU to Further Collaborate on High-Bandwidth Memory for Next-Generation HPC
- JEDEC Publishes New Standard to Support CXL Memory Module Implementation
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- Breaking Ground in Post-Quantum Cryptography Real World Implementation Security Research
- YorChip announces patent-pending Universal PHY for Open Chiplets
E-mail This Article | Printer-Friendly Page |