Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications
August 31, 2022 -- Allegro DVT, the leading provider of video compression and decompression semiconductor IP solutions, today announced that SiMa.ai™, the machine learning company enabling effortless deployment at the embedded edge, has integrated Allegro’s high performance video Encoding and Decoding IPs into its Machine Learning System on a Chip (MLSoC) Platform.
SiMa.ai’s purpose-built software and hardware MLSoC Platform, which is available to customers now, is designed to address any computer vision application while delivering 10x better performance per watt with a push-button experience. Seamless power optimization is critical for computer vision applications at the edge. With Allegro DVT’s Encoder and Decoder IPs, SiMa.ai’s customers can achieve high performance with low power without compromising efficiency or ease of use across markets such as smart vision, robotics, industry 4.0, healthcare, government among others.
“When developing our MLSoC Platform, we wanted a partner with the right technology that could meet the machine learning needs of our customers,” said Srivi Dhruvanarayan, VP Hardware Engineering, SiMa.ai. “We required high performance digital video technology and selected Allegro DVT because it offers the best quality digital video compression solution for ultimate performance at the lowest power. Together, we are delivering a comprehensive documentation and software package for easier integration at the edge.”
Nathalie Brault, COO of Allegro DVT added, “This is an important collaboration for the industry because it combines two cutting edge platforms in our video IPs and SiMa.ai’s MLSoC Platform to deliver best-in-class ML processing at the edge. We are looking forward to being a part of transforming the embedded edge market with SiMa.ai and giving customers the highest power efficiency at their fingertips.”
For more information, contact us.
|
Allegro DVT Hot IP
Related News
- SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge
- Arteris Collaborates with SiMa.ai to Optimize ML Implementation With Efficient Topology Interconnect IP for the Embedded Edge
- SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge
- SiMa.ai Ships First Industry Leading Purpose-built Machine Learning SoC Platform to Customers for Embedded Edge Applications
- SiMa.ai Adopts Arm Technology to Deliver a Purpose-built Heterogeneous Machine Learning Compute Platform for the Embedded Edge
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |