Market Dynamics, Technologies Drive Automotive Design
By Gary Hilson, EETimes (November 11, 2022)
Likening the modern automobile to a server on wheels is starting to sound cliché, but we’re just hitting the tip of iceberg when it comes to the number of electronic components that are finding their way into modern automotive design, as well as the supporting infrastructure for autonomous driving in large urban centers.
In the meantime, the ground underneath is constantly shifting: Supply chain constraints, software defined architectures, functional safety requirements, and the changing dynamics among original equipment manufacturers (OEMs), tier 1 suppliers, and semiconductor companies are altering the landscape of automotive electronics. This dynamic environment was the subject of discussion in a recent panel hosted by ProteanTecs, and, judging from that talk, “changing” may be an understatement.
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- IoT and Automotive to Drive IC Market Growth Through 2020
- ULYSS1, Microcontroller (MCU) for Automotive market, designed by Cortus is available
- SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
- GOWIN's progress in global automotive market gathers momentum with award of ISO 26262 certification for its FPGA design environment
- Intrinsic ID Launches First Hardware Root-of-Trust Solution to Meet Functional Safety Standards for Automotive Market
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset