NoC Silicon IP for RISC-V based chips supporting the TileLink protocol
Modelware Joins IBM Partnerworld and SPI-4.2 Cores Validated as “Ready For IBM Technology”
Red Bank, NJ – April 11, 2003 - Modelware, a leading provider of Semiconductor Intellectual Property (SIP) for telecom and networking-based applications, today announced its participation in IBM's Partnerworld program as a solution provider for IBM Microelectronics ASIC (application specific integrated circuit) customers. Under this program, Modelware can use the "Ready For IBM Technology" designation for its SPI-4.2 Link Layer and PHY solution.
IBM's "Ready for IBM Technology" program has been expanded to include foundry and ASIC solutions, reinforcing the company's increased investment in these two businesses. As part of today's announcement, Modelware's SPI-4.2 Link and PHY Solution has been validated and is qualified to use the "Ready for IBM Technology" mark for IBM's Cu-11 technology.
IBM's "Ready for IBM Technology" solutions are designed to help OEM customers speed time to market, reduce development risk, lower development costs, and improve return on investment. The "Ready for IBM Technology" mark identifies solutions that have been tested and validated for compatibility with IBM Microelectronics products by the solution developers and assures that these solutions are compatible with IBM Microelectronics products. This helps IBM expand its technology appeal to OEMs by bringing additional value to the solution a customer purchases.
IBM and Modelware have been cooperating on several SPI-4.2 projects. In addition to joining IBM's Blue Logic IP Collaboration program, Modelware has verified the interoperability between IBM's SPI-4.2 PHY and Modelware's SPI-4.2 Link Layer simulation models. Several IBM ASIC customers have already used Modelware's SPI-4.2 cores.
"Winning the "Ready For IBM Technology" validation is one more tribute to the success of our SPI-4.2 cores." said Anthony Dalleggio, Executive VP of Modelware. "IBM customers will receive the great value and excellent technical support they have come to expect."
About Modelware's PluriBus™ PL4/SPI-4.2 Foundation and Manager Cores
Modelware offers a range of scalable and customizable PL4/SPI-4.2 solutions for both ASICs and FPGAs. Modelware has been licensing PL4/SPI-4.2 cores since November 2000 and has continued to enhance their performance and add the features most requested by expert system designers. Modelware's SPI-4.2 cores contain patent-pending technology that allows them to achieve very high levels of performance. The PluriBus SPI-4.2 Foundation and Manager Link Layer cores are compatible with Modelware's SPI-4.2 PHY soft core as well as IBM's SPI4.2 PHY hard macro. SPI-4.2 Foundation implements the SPI-4.2 interface protocol and gives device designers the flexibility of implementing their own proprietary packet-level processing. SPI-4.2 Manager implements a total SPI-4.2 solution including channelized packet-level processing and scheduling. In addition to compliance with the standards, Modelware ensures that its SPI-4.2 products also interoperate with ASSPs (application-specific standard product) from several device manufacturers. Modelware's SPI-4.2 ASIC design package includes RTL for the core and the advanced test bench, simulation and synthesis scripts, and clear and thorough documentation.
About IBM Microelectronics
IBM Microelectronics is a key contributor to IBM's role as the world's premier information technology supplier. It develops, manufactures and markets state-of-the-art semiconductor and interconnect technologies, products and services. IBM Microelectronics activities are focused in three major areas: custom application specific integrated circuit (ASIC) chips, PowerPC-based standard chip products, and high-tech foundry services. Its superior integrated solutions can be found in many of the world's best-known electronic brands.
IBM is a recognized innovator in the chip industry, having been first with advances like more power-efficient copper wiring in place of aluminum, faster silicon-on-insulator (SOI) and silicon germanium transistors, and improved low-k dielectric insulation between chip wires. These and other innovations have contributed to IBM's standing as the number one U.S. patent holder for 10 consecutive years. More information about IBM Microelectronics can be found at: http://www.ibm.com/chips.
About Modelware, Inc
Modelware is a leading provider of Semiconductor Intellectual Property (SIP) cores for telecom and networking ASIC and FPGA applications. Its highly scalable products provide semiconductor and system OEM customers a compelling value and enable them to bring standards-compliant products to market faster. By offering design services that complement its standard product offering, Modelware provides customized solutions that exactly match the customer's application. Modelware's products and services are backed with an exceptional level of support that is available to customers throughout their product design cycle. For more information, visit www.modelware.com.
© Copyright Modelware, Inc. 2003. All rights reserved. MODELWARE® is a registered trademarks of Modelware, Inc. PluriBus™ is a trademark of Modelware, Inc.
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