English
7 µW always on Audio feature extraction with filter banks on TSMC 22nm uLL
China forms its own chiplet standard amid isolation
By Peter Clarke, eeNews Analog (March 27, 2023)
The China Chiplet Industry Alliance has released the ‘Chiplet Interconnection Interface Standard’ known as ACC1.0, according to the Financial Association Press.
The standard defines a high-speed serial port and is focused on optimization based on the domestic packaging and substrate supply chain, with cost and commercial practicality as a key consideration, the report said. The standard was developed by the Cross Information Core Technology Research Institute working with the China Chiplet Industry Alliance, which includes domestic system, IP, and packaging manufacturers.
|
E-mail This Article | 
|
|
Printer-Friendly Page |
Related News
- Eliyan Sets New Standard for Chiplet Interconnect Performance with Latest PHY Delivering Data Rate of 64Gbps on 3nm Process Using Standard Packaging
- Keysight Introduces Chiplet PHY Designer for Simulating D2D to D2D PHY IP Supporting the UCIe™ Standard
- Eliyan Supports Latest Version of UCIe Chiplet Interconnect Standard, Continues to Drive Performance and Bandwidth Capabilities to 40Gbps and Beyond to Help Meet the Needs of the Multi-die Era
- JEDEC Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard
- Innolink - The advanced Chiplet solution complies with the Universal Chiplet Interconnect Express (UCIe) standard
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results