English
TurboConcept and Lomicro Information Technology today celebrate two years of successful collaboration
Brest, France and Shanghai, China -- April 3rd, 2023 -- TurboConcept, the industry-reference IP Core provider for Forward Error Correction (FEC) IP cores today celebrates two years of successful collaboration with Shanghai LoMicro Information Technology Co., Ltd , specialized in distributing IP Core and related technologies in China.
Jacky Tousch, co-founder and CEO of TurboConcept said:
“LoMicro is an ideal partner to support and expand our market presence in China, by leveraging a strong market knowledge and an accurate understanding of our customer requirements and expectations. LoMicro team is engaged helping our customers in different phases of their project, from early stages to technical support.
We started collaboration with LoMicro in 2021 and are very satisfied by our partnership: LoMicro has already significantly impacted our market expansion in China. We are looking forward to continuing and strengthen our relationship and serve together our future customers.”
Robert Xu, president of LoMicro, said:
“TurboConcept is a reference IP Core provider of FEC IP Cores. They have a comprehensive portfolio of products addressing all FEC technologies needed for 4G-LTE and 5G-NR systems, including LDPC, Polar and Turbo encoder and decoder Cores.
Customers are looking for performance and efficiency in throughput, silicon area and power consumption. TurboConcept’s reliable and silicon-proven products, allow our customers to derisk investments and planning, and to concentrate on their specific market differentiators and technology. The customers adopting TurboConcept solutions are very satisfied with the product quality, performance, and the efficient technical support. “
More about TurboConcept
More about LoMicro
|
||||||
Related News
- intoPIX to Celebrate Successful Collaboration with Bridge Technologies at IBC 2023
- Qualitas Semiconductor Secures Multiple Project Licensing Agreements with Pansemi Following Successful Initial Collaboration
- Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design
- RISC-V International Achieves Milestone with Ratification of 40 Specifications in Two Years
- Arm Announces New Automotive Technologies to Accelerate Development of AI-enabled Vehicles by up to Two Years
Breaking News
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
|
E-mail This Article | 
|
|
Printer-Friendly Page |