ULTRARAM™ universal computer memory to be commercialised
April 4, 2023 -- Lancaster University is to create a spinout company to commercialise the universal computer memory technology ULTRARAM™.
Invented by Physics Professor Manus Hayne, ULTRARAM™ is a novel type of memory with extraordinary properties. It combines the non-volatility of a data storage memory, like flash, with the speed, energy-efficiency and endurance of a working memory, like DRAM. To do this it exploits quantum resonant tunnelling in compound semiconductors, materials commonly used in photonic devices such as LEDS, laser diodes and infrared detectors, but not in digital electronics, which is the preserve of silicon.
Initially patented in the US, further patents on the technology are currently being progressed in key technology markets around the world.
ULTRARAM™ is to be commercialised following the successful completion of the ICURe Explore award as part of the prestigious Innovate UK ICURe Programme designed to help researchers explore the commercial application and potential of UK research.
The ULTRARAM™ team was awarded an ICURe Exploit award at an event in Glasgow which marked the culmination of various rounds of selection, from being proposed by the University and accepted onto the ICURe programme and then being selected as a result of the ‘Options Roundabout’.
The ULTRARAM™ team (from left); Technology Transfer Officer Peter Rawling, Business Advisor James Ashforth-Pook, researcher Dr Peter Hodgson, Partnerships and Business Engagement manager Liz Mullis and Professor Manus Hayne.
Jess Wenmouth, Commercialisation Impact Manager at the University said: “The process is a strenuous validation programme of both the scientific development, the market discovery and evidence gathering of need as well as an endorsement of the team’s skills and strengths to take this forward.”
Following this endorsement by the ICURe expert innovation panel, the proposal will develop to become a formal spinout company from Lancaster University, with discussions already taking place with potential investors.
The panel felt the key areas of strength for the project included a clear global opportunity with potentially market changing technology and a huge market potential.
The award also opens the door for the spinout to bid for £300k of Innovate UK funding, exclusively available to successful ICURe ‘graduates’.
|
Related News
- RAAAM™ Memory Technologies Expands Leadership Team With the Addition of Eli Leizerovitz as Chief Business Officer
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification
- Blueshift Memory announces successful development of computer vision AI accelerator chip
- JEDEC Publishes New Standard to Support CXL Memory Module Implementation
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
Breaking News
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |