NVM OTP NeoBit in GLOBALFOUNDRIES (350nm, 250nm, 180nm, 160nm, 150nm, 130nm, 110nm, 65nm, 55nm)
ULTRARAM™ universal computer memory to be commercialised
April 4, 2023 -- Lancaster University is to create a spinout company to commercialise the universal computer memory technology ULTRARAM™.
Invented by Physics Professor Manus Hayne, ULTRARAM™ is a novel type of memory with extraordinary properties. It combines the non-volatility of a data storage memory, like flash, with the speed, energy-efficiency and endurance of a working memory, like DRAM. To do this it exploits quantum resonant tunnelling in compound semiconductors, materials commonly used in photonic devices such as LEDS, laser diodes and infrared detectors, but not in digital electronics, which is the preserve of silicon.
Initially patented in the US, further patents on the technology are currently being progressed in key technology markets around the world.
ULTRARAM™ is to be commercialised following the successful completion of the ICURe Explore award as part of the prestigious Innovate UK ICURe Programme designed to help researchers explore the commercial application and potential of UK research.
The ULTRARAM™ team was awarded an ICURe Exploit award at an event in Glasgow which marked the culmination of various rounds of selection, from being proposed by the University and accepted onto the ICURe programme and then being selected as a result of the ‘Options Roundabout’.
The ULTRARAM™ team (from left); Technology Transfer Officer Peter Rawling, Business Advisor James Ashforth-Pook, researcher Dr Peter Hodgson, Partnerships and Business Engagement manager Liz Mullis and Professor Manus Hayne.
Jess Wenmouth, Commercialisation Impact Manager at the University said: “The process is a strenuous validation programme of both the scientific development, the market discovery and evidence gathering of need as well as an endorsement of the team’s skills and strengths to take this forward.”
Following this endorsement by the ICURe expert innovation panel, the proposal will develop to become a formal spinout company from Lancaster University, with discussions already taking place with potential investors.
The panel felt the key areas of strength for the project included a clear global opportunity with potentially market changing technology and a huge market potential.
The award also opens the door for the spinout to bid for £300k of Innovate UK funding, exclusively available to successful ICURe ‘graduates’.
|
Related News
- RAAAM™ Memory Technologies Expands Leadership Team With the Addition of Eli Leizerovitz as Chief Business Officer
- UCIe™ (Universal Chiplet Interconnect Express™) Consortium Releases its 1.1 Specification
- Blueshift Memory announces successful development of computer vision AI accelerator chip
- JEDEC Publishes New Standard to Support CXL Memory Module Implementation
- Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |