Ceva-Waves Bluetooth 5.3 Low Energy Baseband Controller, software and profiles
Flex Logix Cancels AI Chip, Markets IP for AI and DSP
By Sally Ward-Foxton, EETimes (May 8, 2023)
Flex Logix, an eFPGA company, has stopped selling its InferX X1 AI accelerator chip, and will instead bring the architecture to market as licensable IP, Flex Logix CEO Geoff Tate told EE Times.
“What we were finding was that the market for chips and boards was relatively small,” Tate said. “We didn’t see customers that were very big, except in the automotive space, but the automotive space isn’t really something that a startup can sell into…. Our conclusion was that the best way to take the technology market was to license everything that we built.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
|
Related News
- Fundamental Inventions Enable the Best PPA and Most Portable eFPGA/DSP/SDR/AI IP for Adaptable SoCs
- Flex Logix Announces InferX™ High Performance IP for DSP and AI Inference
- Flex Logix Boosts AI Accelerator Performance and Long-Term Efficiency
- Industry Leading PPA DSP Available For All Existing EFLX eFPGA
- Flex Logix Opens Up Licensing to its InferX AI Technology
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks