Hyper Transport seen reaching 30 million ports in 2003
![]() |
Hyper Transport seen reaching 30 million ports in 2003
By Bernard Cole, EE Times
April 24, 2003 (6:42 p.m. EST)
URL: http://www.eetimes.com/story/OEG20030424S0048
SAN FRANCISCO An industry study to be released next week estimates that the global port count for Hyper Transport switch fabric will exceed 30 million ports this year. International Date Corp. (IDC) said the forecast comes as other alternatives such as Infiniband are still struggling to produce the silicon they need to support the demand for a high-speed interconnects. By 2006, the IDC projects the number of ports will reach 200 million. Hyper Transport technology is licensed on a royalty-free basis through the Hyper Transport Consortium. The univeral chip-to-chip I/O technology that provides high bandwidth, low cost and compatibility with legacy shared-bus PCI I/O technology. Vernon Turner, IDC group vice president, said the 2003 projections are based on actual parts counts ot items shipped and silicon starts and products already committed to production by the end of 2002. Gabriele Satori, president of the consortium, said several different market segments have emerged that are planning products this year based on the HT spec. While the majority of shipments will be for future 64-bit workstations and desktop computers, substantial numbers are already being delivered in the growing number of computing and electronics segments, including game consoles and servers. "The acceptance and use of one of the switch fabrics across s number of different applications will be the determining factor in which alternative will finally dominate," Turner said.
Related News
- Alphacore teams with Southwest Advanced Prototyping HUB at ASU to advance national security with nearly $30 million in federal funding award
- Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports
- Morse Micro Supercharges its Series B Funding Round with AU $30 Million Top-up from Major Superannuation Funds and Others
- QuickLogic Awarded New $3.0 Million eFPGA Contract
- Pliops Raises $30 Million in Series B Funding Led by SoftBank Ventures Asia to Transform Data Center Infrastructure for Cloud, AI and ML
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |