English
SiliconAlly: GigaPHY Testchip is back from Fabrication and Packaging
May 18, 2023 -- A long time of waiting ended this week for Siliconally. We got our test chip, called GigaPHY, back from fabrication and packaging.
The chip contains 2 Dual PHY instances supporting 100BASE-T1 and 1000BASE-T1 communication and 1 Single PHY instance with 100BASE-T1 communication. Additionally we have some more on-chip memory for data collection and GMII and SGMII integrated.
Bringing up a new chip is even for very experienced developers a heartbeat moment. Will the chip get alive at all? Do we have any major bugs? Are all the components integrated correctly? How good does the simulation fit to the real chip?
GigaPHY Data
Chip Technology
- Globalfoundries 22DFX
Automotive Ethernet PHY Instances
Other Interfaces
- 3x SGMII
- 1x GMII/MII
- 1x SPI
- 1x MDIO
- 1x JTAG
|
||||||
Siliconally GmbH. Hot IP
Related News
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Boosting Efficiency and Reducing Costs: Silvaco's Approach to Semiconductor Fabrication
- EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP
- EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP
- EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |