English
Innocor Ships G.709 OTU-2 Test Solution
Almonte, Ontario, Canada - April 25, 2003 - Innocor, a leading provider of broadband transmission and data test equipment today announced the first shipment of their G.709 OTU-2 10Gbps test solution to a major Canadian telecommunications equipment manufacturer.
"This first shipment marks a very important milestone for Innocor in our drive to provide leading edge, flexible test solutions at very affordable prices." said Randy Gill, President of Innocor. "Innocor's G.709 equipped 10G module is the only such product in the market today to offer OTU-2 testing capabilities in a high-density, multi-slot configuration with up to 16 independent OTU-2 test modules in a single 6U shelf."
This first shipment of Innocor's G.709 option will be used in the customer's manufacturing environment. Primary reasons for the selection of Innocor's G.709 OTU-2 test solution include the flexibility of the combined offering, breadth of interfaces, ease of use and cost. Innocor's multi-slot test solution is based on 3 and 17 slot rack mount systems. The G.709 OTU-2 module is a low cost, factory installed plug-in upgrade for the existing Innocor OC- 192/STM-64 SONET/SDH test modules.
Other products in the Innocor scaleable, multi-slot test portfolio include Innocor's multi-rate module which provides the ability to integrate on a single module any subset ports from OC-3/STM 1, OC-12/STM-4, OC-48/STM-16, and Gigabit Ethernet. Also available is a user configurable Optics module that permits the integration of optical components, such as attenuators and optical switches. All of the Innocor multi-slot platform modules support hotinsertion thereby reducing system maintenance and reconfiguration downtime.
About Innocor Ltd.
Established in 1995, Innocor™ designs and manufactures industry-leading test equipment, development systems and IP core technology for telecom applications.
Products include:
- Test equipment for SONET /SDH, ATM and Packet Over SONET (POS), MPLS, 10GbE WAN / LAN, UTOPIA, POS-PHY with interfaces including UTOPIA L1/L2, POS-PHY L2, T1, T3, OC-3 (STM-1), OC- 12 (STM-4), OC-48 (STM-16), OC-192 (STM-64), 10GbE WAN/LAN and 1GbE, OTU-2 G.709 and a user configurable Optics module
- Development platforms for LAN - WAN access protocols or applications development and integration
- Pre-engineered silicon-ready cores for Systems-on-a- Programmable-Chip (SOPC)
- Custom design, engineering and support services
|
||||||
Related News
- Innocor announces an OTN G.709 option module, a new multi-rate SONET/SDH module, as well as the industry’s first user configurable optics module
- UMC Announces 22nm Technology Readiness Following Silicon Validation on World's Smallest USB 2.0 Test Vehicle
- GCT Semiconductor Announces the Industry's First Single-Chip Solution Supporting Both Mobile WiMAX IEEE 802.16e Wave 2 and WiFi 802.11 b/g
- LogicVision's Embedded SerDes Test Selected by PLX Technology for Gen 2 PCI Express Device Family
- QuickLogic Ships the First ArcticLink Solution Platform, with Fully Integrated USB 2.0 High Speed On-the-Go Controller and PHY
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
|
E-mail This Article | 
|
|
Printer-Friendly Page |