Cadence and Samsung Foundry Enter Multi-Year Agreement to Expand Design IP Portfolio
Advanced memory interface IP solution expansion to SF3 and enablement of complete SF5A design IP portfolio with rich interface protocols
SAN JOSE, Calif.— June 14, 2023 -- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that it has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications. Through this agreement, joint customers can obtain a complete design IP solution from Cadence, a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE™), including 112/56/25/10G PHY/MAC, PCI Express® (PCIe®) 6.0/5.0/4.0/3.1 PHY/Controller, Universal Chiplet Interconnect Express™ (UCIe™) PHY/Controller, USB3.x PHY/Controller and a complete PHY and controller offering for GDDR6 and DDR5/4.
The agreement also encompasses the enablement of the latest DDR5 8400+ and GDDR7 solutions on Samsung Foundry’s advanced SF3 technology, providing a future-proof migration path for leading customers seeking a high-performance, high-bandwidth memory interface solution for designing generative AI/ML, hyperscale, and high-performance computing (HPC) applications. The Cadence® design IP solution delivers optimal power, performance, and area (PPA) with rich feature sets to enable uncompromised differentiation, versatility, and innovation for large-scale SoC designs. In addition, Cadence provides full subsystem delivery with integrated PHY and controller IP to simplify integration, minimize risks, and enable faster time to market.
“Cadence and Samsung have been collaborating closely on Samsung EDA and IP ecosystem enablement for years. Through this new multi-year IP expansion plan, we further solidify our commitment to empowering joint customers with access to a complete design IP portfolio on SF5A technology as well as the leading DDR5 8400+ and GDDR7/6 solutions on SF3,” said Jongshin Shin, EVP of Samsung Foundry and Head of IP Ecosystem.
“Cadence is committed to expanding our IP portfolio to address our customers’ evolving design requirements,” said Rishi Chugh, vice president of product marketing in the IP Group at Cadence. “Through this collaboration with Samsung, we can deliver a rich set of high-performance IP with competitive PPA that meets the most demanding requirements for HPC, AI/ML, networking, storage, and automotive applications. Developing the latest GDDR7 IP on SF3 demonstrates our leadership in this market segment.”
Active customer engagements for these IP cores are currently underway. For more information about Cadence design IP solutions, please visit www.cadence.com/go/SFIP.
About Cadence
Cadence is a pivotal leader in electronic systems design, building upon more than 30 years of computational software expertise. The company applies its underlying Intelligent System Design™ strategy to deliver software, hardware and IP that turn design concepts into reality. Cadence customers are the world’s most innovative companies, delivering extraordinary electronic products from chips to boards to complete systems for the most dynamic market applications, including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial and healthcare. For nine years in a row, Fortune magazine has named Cadence one of the 100 Best Companies to Work For. Learn more at cadence.com.
|
Cadence Hot IP
Related News
- Alphawave IP and Verisilicon Expand Partnership with $54M Multi-Year Exclusive Subscription Reseller Agreement for China Market
- Toppan Photomasks and GLOBALFOUNDRIES Enter into Multi-Year Supply Agreement
- Cadence and GLOBALFOUNDRIES Announce Broad, Multi-Year Technology Agreement
- ZF Micro Solutions Signs Multi-Year Foundry Agreement With IBM; First Collaboration Brings ZFx86 FailSafe(R) System-on-a-Chip Back to Market
- Cadence and Samsung Foundry Accelerate Chip Innovation for Advanced AI and 3D-IC Applications
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |