JEDEC Publishes New Standard to Support CXL Memory Module Implementation
ARLINGTON, VA., USA – AUGUST 1, 2023 – JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD317: Compute Express Link (CXL™) Memory Module Base Standard, known as “CMM”. JESD317 CMM defines the specifications of interface parameters, signaling protocols, environmental requirements, packaging, and other features as reference for specific target implementations of CXL™-attached memory modules, and is available for free download from the JEDEC website.
CMM is designed to provide reference base targets for CXLTM-attached memory modules to help simplify system design and minimize industry confusion for first adoption. By leveraging established industry standard specifications from SNIA (EDSFF), PCIe, and CXLTM to define specific module implementations, CMM enables system providers to accommodate certain known devices while leaving room for innovation. The standard also supports system device slots designed to be compatible with both CMMs and traditional PCIe-attached NVMe drives. For a deeper dive, catch JEDEC’s session at FMS 2023 in Santa Clara, CA, on Wednesday, August 9th at 8:30AM: Breaking Past Expansion Limits: CXL-Attached Memory Standards.
“The high-speed memory capabilities offered by CXLTM memory modules are increasingly important to the industry and critical to many emerging applications such as artificial intelligence and data analytics,” said Mian Quddus, JEDEC Board of Directors Chairman. He added: “JEDEC’s goal with the development of JESD317 CMM is to offer suppliers of CXLTM -attached memory industry-aligned targets to support broader adoption.”
“JEDEC’s new CMM standard establishes a first common starting point for CXLTM memory expansion and lowers the barrier of technology adoption for both suppliers and system manufacturers,” noted Jonathan Hinkle, Chair of JEDEC’s CXL Memory Task Group. He added: “In a dedicated effort underscoring the importance of this standard for the industry, key companies joined forces in the TG to align and drive this first standard, including major hyperscale and enterprise system designers, memory suppliers, and processor vendors.”
About JEDEC
JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 350 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. The publications and standards generated by JEDEC committees are accepted throughout the world. All JEDEC standards are available for download from the JEDEC website. For more information, visit https://www.jedec.org.
|
Related News
- JEDEC® Adds to Suite of Standards Supporting Compute Express Link® (CXL®) Memory Technology with Publication of Two New Documents
- JEDEC® Announces Publication of Compute Express Link® (CXL®) Support Standards
- JEDEC Publishes New CAMM2 Memory Module Standard
- CXL Consortium Announces Compute Express Link 3.2 Specification Release
- JEDEC Publishes GDDR7 Graphics Memory Standard
Breaking News
- Cadence to Acquire Secure-IC, a Leader in Embedded Security IP
- Blue Cheetah Tapes Out Its High-Performance Chiplet Interconnect IP on Samsung Foundry SF4X
- Alphawave Semi to Lead Chiplet Innovation, Showcase Advanced Technologies at Chiplet Summit
- YorChip announces patent-pending Universal PHY for Open Chiplets
- PQShield announces participation in NEDO program to implement post-quantum cryptography across Japan
Most Popular
- Qualitas Semiconductor Signs IP Licensing Agreement with Edge AI Leader Ambarella
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura's Cyberthreat Intelligence Tool
- Altera Launches New Partner Program to Accelerate FPGA Solutions Development
- Alchip Opens 3DIC ASIC Design Services
- Electronic System Design Industry Posts $5.1 Billion in Revenue in Q3 2024, ESD Alliance Reports
E-mail This Article | Printer-Friendly Page |