Analog Bits to Demonstrate Automotive Grade IP's Including a Novel High Accuracy Sensor at TSMC 2023 North America Open Innovation Platform Ecosystem Forum
Sunnyvale, CA, September 27, 2023 – Analog Bits (www.analogbits.com), the industry’s leading provider of low-power mixed-signal IP (Intellectual Property) solutions will be demonstrating Automotive Grade silicon data in TSMC N5A process as well as their new novel high accuracy temperature Sensor at TSMC 2023 North America Open Innovation Platform® (OIP) Ecosystem Forum. This development is part of Analog Bits’ broadening portfolio of Mixed Signal IP in advanced TSMC 3nm, 4nm, and 5nm processes, and design kits are available now.
“As we work with leading edge automotive customers on advanced FinFet processes, thermal issues continue to be a concern and need for multiple instances of sensors continues. Furthermore, many applications cannot have additional test costs associated with trimming for higher accuracy” said Mahesh Tirupattur, Executive Vice President at Analog Bits. “We have been working on designs for improving un-trimmed accuracy in FinFets and reducing the area of the Sensors and we are pleased to demonstrate working silicon of these higher accuracy Sensors on N5A process. Come and watch the demo at our booth.”
When:
September 27th, 2023
Resources
To learn more about Analog Bits' foundational analog IP, visit www.analogbits.com or email us at info@analogbits.com.
About Analog Bits
Founded in 1995, Analog Bits, Inc. is the leading supplier of mixed-signal IP with a reputation for easy and reliable integration into advanced SOCs. Our products include precision clocking macros, Sensors, programmable interconnect solutions such as multi-protocol SERDES and programmable I/O’s. With billions of IP cores fabricated in customer silicon, from 0.35 micron to 3nm processes, Analog Bits has an outstanding heritage of "first-time-working” with foundries and IDMs.
|
Related News
- Analog Bits to Demonstrate Power Management and Embedded Clocking and High Accuracy Sensor IP at the TSMC 2024 Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Pinless PLL and Sensor IP in TSMC N4 and N5 Processes at TSMC 2022 North America Open Innovation Platform® Ecosystem Forum
- Analog Bits to demonstrate Low Power SERDES at TSMC's Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate New High Performance and Ultra-Low Power SERDES IP at TSMC Open Innovation Platform Ecosystem Forum
- Analog Bits to Demonstrate Numerous Test Chips Including Portfolio of Power Management and Embedded Clocking and High Accuracy Sensor IP in TSMC N3P Process at TSMC 2024 North America Technology Symposium
Breaking News
- Jury is out in the Arm vs Qualcomm trial
- Ceva Seeks To Exploit Synergies in Portfolio with Nano NPU
- Synopsys Responds to U.K. Competition and Markets Authority's Phase 1 Announcement Regarding Ansys Acquisition
- Alphawave Semi Scales UCIe™ to 64 Gbps Enabling >20 Tbps/mm Bandwidth Density for Die-to-Die Chiplet Connectivity
- RaiderChip Hardware NPU adds Falcon-3 LLM to its supported AI models
Most Popular
E-mail This Article | Printer-Friendly Page |