Wi-Fi 6 (ax)+BLEv5.4+15.4 Dual Band RF IP for High-End Applications.
Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
SAN JOSE, California – Oct 9, 2023 – Omni Design Technologies, a leading provider of low-power, high-performance mixed-signal Intellectual Property (IP) solutions, announced that it will present “Next Generation LiDAR Solutions: Unleashing the Power of High-Performance Low Power Data Converters” at CadenceLIVE Europe 2023 on October 10 & 11 in Munich, Germany.
This presentation, delivered jointly with Cadence, will focus on the adoption of LiDAR in the automotive driver assistance (ADAS) market and the role of high-performance, low-power data converters in next-generation LiDAR systems. The presentation is based on the ongoing collaboration between Omni Design and Cadence on a solution combining DSP IP with data converters for deployment in the automotive market.
About Omni Design Technologies
Omni Design Technologies is the leading provider of high-performance, ultra-low power mixed signal IP cores in advanced process technologies that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, automotive, imaging, sensors, and IoT. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas (California), with additional offices in Fort Collins (Colorado), Billerica (Massachusetts), Bangalore (India), Hyderabad (India), and Ireland. For more information, visit www.omnidesigntech.com.
|
Related News
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters
- Omni Design Announces Availability of LiDAR Receiver Subsystem
- Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles
- GUC and Omni Design Tape Out 16nm LiDAR SoC
- Omni Design Technologies Delivers Multi-Gigahertz SWIFT™ Data Converter Solutions for Satellite Communications
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |