Omni Design to Present Next Generation LiDAR Solutions at CadenceLIVE Europe
SAN JOSE, California – Oct 9, 2023 – Omni Design Technologies, a leading provider of low-power, high-performance mixed-signal Intellectual Property (IP) solutions, announced that it will present “Next Generation LiDAR Solutions: Unleashing the Power of High-Performance Low Power Data Converters” at CadenceLIVE Europe 2023 on October 10 & 11 in Munich, Germany.
This presentation, delivered jointly with Cadence, will focus on the adoption of LiDAR in the automotive driver assistance (ADAS) market and the role of high-performance, low-power data converters in next-generation LiDAR systems. The presentation is based on the ongoing collaboration between Omni Design and Cadence on a solution combining DSP IP with data converters for deployment in the automotive market.
About Omni Design Technologies
Omni Design Technologies is the leading provider of high-performance, ultra-low power mixed signal IP cores in advanced process technologies that enable highly differentiated systems-on-chip (SoCs) in applications ranging from wired and wireless communications, automotive, imaging, sensors, and IoT. Omni Design, founded in 2015 by semiconductor industry veterans, has an excellent track record of innovation and collaboration with customers to enable their success. The company is headquartered in Milpitas (California), with additional offices in Fort Collins (Colorado), Billerica (Massachusetts), Bangalore (India), Hyderabad (India), and Ireland. For more information, visit www.omnidesigntech.com.
|
Related News
- Omni Design Technologies Unveils Next-Gen LiDAR Solutions with Swift™ Data Converters
- Omni Design Announces Availability of LiDAR Receiver Subsystem
- Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles
- GUC and Omni Design Tape Out 16nm LiDAR SoC
- QuickLogic to Showcase Advanced eFPGA Hard IP Solutions at Space Tech Expo Europe 2024
Breaking News
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Cadence Unveils Arm-Based System Chiplet
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |