New POLYN Patent Covers Smart Tires, Industrial IoT Applications
October 20, 2023 – POLYN Technology, a fabless semiconductor company supplying application-specific Neuromorphic Analog Signal Processing (NASP) technology and products, has been granted its first U.S. patent.
The new patent further strengthens not only the overall technological intellectual property (IP), but also the company’s special use cases portfolio. It also extends POLYN’s competitive advantage in performing efficient data preprocessing at the sensor edge using neural networks.
This patent specifically protects use of POLYN technology in “smart tire” applications, among others, where neural networks, implemented on the NASP chip revolutionize the amount and depth of information which can be transmitted from the tire to the driver’s dashboard and to the vehicle’s computer.
So far this year, five patents have been granted in the U.S. and other countries. The non-U.S. patents have broader scopes of claims to the underlying POLYN proprietary technology of converting neural networks into the corresponding semiconductor chips implementation; these provide the broadest protection of the company’s IP.
The U.S. patent is narrower, concentrating on specific applications of POLYN’s VibroSense™ technology segment, applicable not only to tires, but to the broader Industrial IoT segment. It demonstrates the company’s commitment to developing cutting-edge Neuromorphic Front-End (NFE) IP, based on NASP, that delivers exceptional power and performance efficiency.
“Our growing IP portfolio reflects more than four years of neuromorphic architecture research and development,” said Boris Maslov, Chairman of the Board of POLYN Technology. “As we continue to innovate and improve our technology at the Smart Thin Edge, we enable our partners to create unprecedented intelligent applications. The new patent further cements our leadership in on-sensor products and development of neuromorphic IP.”
The POLYN portfolio now includes more than two dozen additional patent applications pending in the U.S. Europe, Japan, Korea, India, China, and elsewhere.
|
Related News
- Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications
- Atmel Ships World’s Highest-Performing ARM Cortex-M7 based MCUs With Atmel | SMART SAM S/E Series Targeting IoT and Industrial Markets
- GlobalFoundries and NXP to Deliver Next-Generation 22FDX Solutions for Automotive, IoT and Smart Mobile
- Ceva Expands its Market Share Leadership in Wireless Connectivity IP, Strengthening its Solutions for Smart Edge AI/IoT applications
- STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module
Breaking News
- JEDEC® and Industry Leaders Collaborate to Release JESD270-4 HBM4 Standard: Advancing Bandwidth, Efficiency, and Capacity for AI and HPC
- BrainChip Gives the Edge to Search and Rescue Operations
- ASML targeted in latest round of US tariffs
- Andes Technology Celebrates 20 Years with New Logo and Headquarters Expansion
- Creonic Unveils Bold Rebrand to Drive Innovation in Communication Technologies
Most Popular
- Cadence to Acquire Arm Artisan Foundation IP Business
- AMD Achieves First TSMC N2 Product Silicon Milestone
- Why Do Hyperscalers Design Their Own CPUs?
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- New TSN-MACsec IP core for secure data transmission in 5G/6G communication networks
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |