NoC Silicon IP for RISC-V based chips supporting the TileLink protocol
TriCN appoints Dale Olstinske Vice-President of Sales
Company is Poised to Expand Sales Focus Internationally.
SAN FRANCISCO, CA – May 19, 2003 –TriCN, a leading provider of semiconductor intellectual property (IP), today announced the appointment of Dale Olstinske as Vice President of Sales. Mr. Olstinske brings more than twenty-five years of sales and management experience in the semiconductor industry to this strategic new role.
Founded in 1997, TriCN is a premier developer of high performance interface IP, providing crucial components to semiconductor designers seeking to move large amounts of data on and off the chip. Olstinske's appointment comes in the wake of the expansion of TriCN's product portfolio to include a comprehensive Base I/O library targeted towards high performance applications.
"Dale brings valuable knowledge of both the semiconductor and IP markets to TriCN at a critical time," said Joe Curry, CEO of TriCN. "With our recent product introductions, TriCN is well positioned to satisfy all the interface IP needs of semiconductor designers. Dale's experience at growing and managing a worldwide sales force will allow TriCN to fully realize our revenue potential."
"TriCN's products provide an excellent solution to chip designer's escalating need for high performance interfaces," said Olstinske. "Moreover, TriCN's product development plans (such as their PCI Express project) ensure that the company is well suited to dominate this space moving into the future. This is an exciting opportunity, and I look forward to growing the business both domestically and internationally."
About Dale Olstinske
A 1978 graduate of the University of Wisconsin with a BS in Electrical and Computer Engineering, Dale Olstinske has had more than a twenty five-year association with the semiconductor industry. Starting his career at Intel Corporation, he has held senior sales and management positions at Marten, LSI Logic, and Frequency Technology. In his most recent position at LogicVision, Dale was responsible for growing worldwide sales revenue through the period of the company's IPO.
About TriCN
Founded in 1997, San Francisco, California-based TriCN is a leading developer of high- performance semiconductor interface intellectual property (IP). The company provides a complete portfolio of IP for maximizing data throughput on and off the chip. Products range from a complete Base I/O library, to general-purpose interface products, interface specific I/O (ISI/O), mixed signal products, and multi-gigabit SerDes products. TriCN's IP is designed for IC developers addressing bandwidth-intensive applications in the communications, networking, data storage, and memory space. TriCN's customers range from startup to established fabless semiconductor and systems companies, including Philips, MIPS Technologies, SGI, IBM, Cognigine, Internet Machines, and Apple Computer.
For more information, please visit TriCN's web site at www.tricn.com.
TriCN: The Single Source for Interface IP™
|
Related News
- Uniquify Appoints Dale Olstinske Senior Vice President of Worldwide Sales
- Mobiveil Appoints Semiconductor IP Industry Veteran Dale Olstinske as the New Vice President of Sales
- CoWare Appoints Allen Spence Vice-President Worldwide Services
- Breker Verification Systems Appoints Andy Stein Vice President of Worldwide Sales as Company Scales New Business Opportunities
- Flex Logix Appoints Lee Leibig As Vice President Of Sales For AI Inference
Breaking News
- HPC customer engages Sondrel for high end chip design
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- TSMC drives A16, 3D process technology
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
E-mail This Article | Printer-Friendly Page |