Spectral Releases Advanced Quality Assurance & Data Analytics tool to validate advanced node Memory Compilers
Quality Assurance, Memory Compilers, Memory Development Platform, SRAMs, 3nm & 5nm process nodes
SOMERVILLE, NEW JERSEY, USA, March 19, 2024 -- Spectral Design & Test Inc. (SDT) is announcing today the addition of an analysis tool to its Memory Development Platform (MDP) software. MemoryQual™ that will enable Memory IP developers and IC designers to improve the quality of their end products.
Tiling complex Memory arrays and characterizing them over a slew of parameters can be a very daunting task. Memory Compiler developers use a combination of raw characterized data and scripts to generate enormous amount of critical data that is eventually used as building blocks for advanced chip level integration. On rare occasions, faulty data in the compilers can lead to timing closure issues. To build the confidence level and sanctity of the timing, power and area views generated by the Memory Compiler developers, a set of Quality Assurance text and graphical reports is imperative. Additionally, chip designers can use the charts generated by MemoryQual to select parameters that give them the most optimal Performance Power, Area outcomes.
SDT is the only independent foundation IP developer that is addressing the needs of several of its Embedded Memory customers, who require the best software tools to address their chip development needs "Our customers have extreme needs for high speed low power reliable embedded Memory in advanced nodes, it is imperative that Memory compilers have data integrity and transparency, we internally use MemoryQual to validate SDT compilersin the 3nm/5nm process nodes, our end users also get to use this tool to make their selection of Memory macros. ” said Deepak Mehta President & CEO of SDT.
Spectral will be demonstrating it’s most advance MDP platform namely MemoryCanvas, MemoryTime and MemoryQual at GOMAC 2024 in Charleston, South-Carolina, USA.
About Spectral Design & Test, Inc.
Spectral is a point solution provider specialized in embedded memory development. Our products address the needs of library developers & SOC designers. Spectral currently supports customers in several different markets namely medical, IoT, 5G infrastructure and many others. For more information, visit http://www.spectral-dt.com or email us at sales@spectral-dt.com
|
Spectral Design & Test Inc. (SDT) Hot IP
Related News
- Spectral Design & Test Announces AI/ML Based Breakthrough Technology to Do Fast and Accurate Characterization & Validate Memory Compilers
- Spectral announces "Enablement Package" for Silicon proven Reference SRAM designs on advanced process nodes
- Tower Semiconductor adopts Legend’s CharFlo-Memory! for quality assurance of commercially available memory compilers
- Siemens' Tessent In-System Test software enables advanced, deterministic testing throughout the silicon lifecycle
- LDRA Announces Extended Support for RISC-V High Assurance Software Quality Tool Suite to Accelerate On-Target Testing of Critical Embedded Applications
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |