SmartSoC Solutions Joins TSMC Design Center Alliance to Boost Semiconductor Innovation in India
India -- March 27, 2024 -- SmartSoC Solutions, a leading Indian semiconductor design services company founded in 2016, is excited to announce its membership in the Design Center Alliance (DCA) of TSMC’s Open Innovation Platform® (OIP). This partnership signifies a major step forward in SmartSoC's mission to foster indigenous semiconductor solutions tailored to India's burgeoning technological landscape.
Established in 2016, SmartSoC Solutions embodies India's rich legacy of innovation, dedicated to developing cutting-edge semiconductor, embedded, and system designs that drive the nation's technological progress. With strategically located design centers in Bangalore, Hyderabad, and Hubli, SmartSoC leverages local talent and expertise to address the unique challenges and opportunities within India's semiconductor industry.
By collaborating with the TSMC Design Center Alliance, SmartSoC gains access to a wealth of resources, including TSMC's process technology information, design methodologies, and support services. This partnership not only enhances SmartSoC's capabilities but also underscores the company's commitment to delivering semiconductor solutions that foster innovation and advancement within India's growing semiconductor sector.
Under the leadership of Bharath Desareddy, CEO of SmartSoC, the company expresses profound enthusiasm for this collaboration, emphasizing its pivotal role in propelling India's semiconductor industry forward. Desareddy comments, "As an Indian company with a vision to pioneer semiconductor solutions that empower India's technological aspirations, our membership in TSMC’s Design Center Alliance is a significant stride towards realizing this vision. By leveraging collective expertise and resources, we aim to drive innovation and shape the future of India's semiconductor landscape."
Membership in the TSMC DCA solidifies SmartSoC's position as a leading player in India's semiconductor landscape, underscoring the company's unwavering commitment to excellence and innovation. SmartSoC's status as one of 27 DCA members highlights its standing within the industry. Becoming a member of TSMC’s DCA will help SmartSoC enhance its global presence and contribute to technological advancement within India's semiconductor ecosystem.
With access to cutting-edge process technologies, including 3nm technologies, SmartSoC is poised to deliver semiconductor designs that offer performance, efficiency, and reliability. As an Indian company with a global outlook, SmartSoC remains steadfast in its commitment to driving semiconductor innovation that not only caters to the Indian market but also contributes to India's emergence as a leading global semiconductor hub.
About SmartSoC Solutions:
Established in 2016, SmartSoC Solutions is an Indian semiconductor design services company headquartered in Bangalore. With a robust presence in Bangalore, Hyderabad, and Hubli, and a global footprint spanning the USA, South Korea, Sweden, Malaysia, Israel, Canada, and Finland, SmartSoC is dedicated to developing innovative semiconductor solutions that cater to India's evolving technological landscape.
|
Related News
- MOSCHIP joins TSMC Design Center Alliance
- EnSilica joins TSMC Design Center Alliance
- Agile Analog joins TSMC Open Innovation Platform IP Alliance Program
- Agile Analog joins Intel Foundry Services Accelerator IP Alliance Program to drive forward semiconductor design innovation
- Sevya joins TSMC Design Center Alliance
Breaking News
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
- Intel in advanced talks to sell Altera to Silverlake
- Logic Fruit Technologies to Showcase Innovations at Embedded World Europe 2025
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
- RaiderChip NPU for LLM at the Edge supports DeepSeek-R1 reasoning models
- YorChip announces Low latency 100G ULTRA Ethernet ready MAC/PCS IP for Edge AI
- AccelerComm® announces 5G NR NTN Physical Layer Solution that delivers over 6Gbps, 128 beams and 4,096 user connections per chipset
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |