intoPIX Unveils Titanium at NAB for Accelerating IP Media Workflows
A breakthrough range of IP solutions unlocking the full power of JPEG XS with SMPTE 2110 and IPMX
NAB Show – Las Vegas, 12 April 2024 – intoPIX, the leading provider of low-latency lightweight JPEG XS technologies and solutions, is thrilled to announce the release of TITANIUM, a groundbreaking range of solutions designed to empower developers, installers, and end-users in accelerating the deployment of SMPTE 2110 and IPMX with intelligent JPEG XS connectivity in their media and entertainment workflows.
"Combining JPEG XS with ST2110 & IPMX makes IP-based media workflows more attractive by bringing together high video quality, low latency, and bandwidth efficiency", said Jean-Baptiste Lorent, Marketing & Sales Director at intoPIX.
Titanium at NAB, intoPIX booth will show the two new families of solutions at the show:
Titanium SDK & EDK for developers.
Offering a comprehensive software development kit for workstations and servers (TitaniumSDK), leveraging embedded CPU, multi-processes and discrete GPU, supporting both PCIe NIC cards and integrated NICs, and both compressed and uncompressed ST2110, and an embedded development kit (TitaniumEDK) specifically made for SoC devices, with some specific flavors addressing Nvidia Jetson SoC and AMD FPGASoC and other ARM SoC, using their integrated NIC and leveraging software or hardware codec accelerations.
Titanium APPs for installers and end-users.
Introducing TitaniumViewer, an application that transforms laptops and workstations into efficient viewers of SMPTE2110 or IPMX streams, and TitaniumShow, which turns laptops and workstations into single to multiple JPEG XS IP-based sources with display resolutions of all sizes.
The Titanium solutions, boasting native NMOS support alongside JPEG XS, ST2110, and forthcoming IPMX compatibility, harness the robust capabilities of intoPIX's JPEG XS-based technologies. Offering support for 4:2:2, 4:4:4, 8-, 10- and 12-bit colors, and optimized coding performances across any resolution, these releases represent a significant leap forward. Tested with a variety of ST2110/IPMX equipment, the new Titanium solutions promise to boost the industry transition to standard-based IP media workflows.
Join us at the NAB Show in Central Hall (#C6025) to explore the new Titanium SDK, EDK, and APPs, and to witness live demonstrations of their capabilities. For more information or to schedule a meeting, follow this link: http://www.intopix.com/nab
|
intoPIX Hot IP
Related News
- intoPIX Unveils Latest JPEG XS FPGA Cores with Nextera-Adeas ST2110/IPMX, Streamlining IPMX Development at NAB Show
- intoPIX and Media Links: Powering Next-Generation IP Media Transport with JPEG XS at InterBEE 2024
- Silicon IP Provider, Chips&Media Unveils New Multi Video Codec IP, WAVE6 Gen2+
- intoPIX Launches Access Program for Titanium Viewer and Titanium Show Apps at IBC 2024 Amsterdam
- intoPIX Launches Titanium at InfoComm, Boosting professional AV-over-IP Workflow Efficiency
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |