SuperH agreement with Atlantic Technology for chip packaging
SuperH uses European supplier for fast turn around assembly
May 29, 2003 - SuperH, Inc., the leading supplier of multimedia RISC CPU cores, has today announced the signing of a manufacturing agreement with Atlantic Technology, Europe's largest semiconductor assembly and test services provider. Under the terms of the agreement, Atlantic Technology will assemble and package SuperH's latest SH-5, 64-bit CPU test chip into a 456-PBGA package at its facility in Crumlin, South Wales, UK. SuperH will use the test chip for IP validation and benchmarking with its MicroDev modular development platform.
SuperH selected Atlantic Technology after considering a wide range of global facilities. A major factor in SuperH's decision was Atlantic Technology's expertise with advanced packaging techniques and its fast turnaround for assembly and test of prototype devices
Located in South Wales' Technology Valley, Atlantic Technology houses Europe's most comprehensive semiconductor assembly and test resource offering a broad device-packaging portfolio with more than 100 different packaging solutions, from traditional leaded packages through to BGA and QFN. It has a capacity of more than 15 million units per month.
The SH-5 64-bit general purpose CPU is designed for high performance multimedia applications, the 64-bit architecture delivers massive 'DSP' performance through its FPU and SIMD instruction sets. Licensees use the SH-5 in a range of applications from blade servers to graphics engines. The test chip integrates peripherals including SDRAM and Flash memory interfaces, UART, timers and a 32-bit PCI bridge. Silicon for the SH-5 test chip is being manufactured by TSMC in Taiwan in the company's 0.13u CMOS process.
"Test chips are vital for IP companies to validate their IP" says Atsushi Hasegawa, Director of Hardware Engineering at SuperH. "Having a world-class operation on our doorstep is a major benefit, and supports our focus on reducing time-to-market for our licensees. We are delighted to be partnering with Atlantic Technology."
"Atlantic recognizes that local support and fast cycle-times are a key factor for the new generation of IP and fabless companies." said Jeff Baloun, Managing Director of Atlantic Technology. "Whilst our core business is focused on high-volume probe, assembly and test, we are very pleased to be working with SuperH in this fast growing market."
About Atlantic Technology
Atlantic Technology is Europe's most comprehensive semiconductor assembly and test facility in the contract-manufacturing marketplace. The company offers turnkey solutions, including package design, design for test, wafer probing, assembly, final test and tape & reel, as well as providing direct-shipments to global customers through its well-proven internet enabled logistics system. Its assembly package portfolio spans traditional leaded packages (QFP, TSSOP, PLCC) through to today's advanced LF/TF/VFBGA and QFN styles. With its headquarters in Crumlin, South Wales (UK), the company employees more than 250 staff. More information is available at: www.atlantic1.co.uk
|
Related News
- DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU)
- Faraday and Kiwimoore Succeed in 2.5D Packaging Project for Mass Production
- Synopsys Enters Definitive Agreement with Keysight Technologies For Sale of Optical Solutions Group
- Faraday Unveils Advanced Packaging Coordinated Platform for Multi-source Chiplets
- Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |