AI Edge Inference IP Leader Expedera Opens R&D Office in India
Santa Clara, California, June 4, 2024 — Expedera Inc, a leading provider of scalable Neural Processing Unit (NPU) semiconductor intellectual property (IP), today announced the opening of its newest R&D center in Hyderabad.
Demand for semiconductors is projected to increase significantly through 2030, and semiconductor companies are ramping up to keep pace. However, a study released by the Semiconductor Industry Association (SIA), in partnership with Oxford Economics, has projected a shortfall of 67,000 workers—technicians, computer scientists, and engineers—by 2030 and a gap of 1.4 million such workers in the broader US economy. India, with its engineering talent, is poised to fill this void. With this announcement, Expedera now joins the list of top semiconductor companies with design and R&D centers in India.
“Market growth and the Indian government’s commitment to invest $15B in establishing a robust semiconductor ecosystem within the country promise to create a large supply of top semiconductor talent,” said Da Chuang, co-founder and CEO of Expedera. “Fueled by a rapidly developing semiconductor ecosystem, India has the potential to become a focal point of innovation, making it an appealing choice for our new design center.”
The new design center, Expedera India Private Limited, in Hyderabad, Telangana, India,
is the company’s sixth global development center focused on edge AI inference. Additional locations include Santa Clara (USA), Shanghai, Taipei, Bath (UK), and Singapore. For more information or to contact an Expedera representative in your region, visit www.expedera.com.
About Expedera
Expedera provides scalable neural engine semiconductor IP that enables major performance, power, and latency improvements while reducing cost and complexity in edge AI inference applications. Third-party silicon validated and customer-proven in well over 10 million devices, Expedera’s solutions produce superior performance and are scalable to a wide range of applications from edge nodes and smartphones to automotive. Expedera’s Origin Neural Processing Unit products are easily integrated, readily scalable, and customized to unique customer use cases and requirements. The company is headquartered in Santa Clara, California, with engineering development centers and customer support offices in the United Kingdom, China, Taiwan, Singapore, and India. Visit https://www.expedera.com
|
Expedera Inc. Hot IP
Related News
- AI Silicon IP Provider Expedera Opens R&D Office in Singapore
- M31 Opens Bangalore R&D Design Center in India Expands Recruitment of Global Talent
- Flex Logix Accelerates Growth With New Office In Austin; Prepares For Global Expansion Of Its Edge AI Inference Product Line
- Cadence Opens Expanded Shanghai Sales Office and R&D Center
- Xilinx Opens Development Centre In India To Strengthen Global R&D Ecosystem
Breaking News
- Ubitium Debuts First Universal RISC-V Processor to Enable AI at No Additional Cost, as It Raises $3.7M
- TSMC drives A16, 3D process technology
- Frontgrade Gaisler Unveils GR716B, a New Standard in Space-Grade Microcontrollers
- Blueshift Memory launches BlueFive processor, accelerating computation by up to 50 times and saving up to 65% energy
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
Most Popular
- Cadence Unveils Arm-Based System Chiplet
- CXL Fabless Startup Panmnesia Secures Over $60M in Series A Funding, Aiming to Lead the CXL Switch Silicon Chip and CXL IP
- Esperanto Technologies and NEC Cooperate on Initiative to Advance Next Generation RISC-V Chips and Software Solutions for HPC
- Eliyan Ports Industry's Highest Performing PHY to Samsung Foundry SF4X Process Node, Achieving up to 40 Gbps Bandwidth at Unprecedented Power Levels with UCIe-Compliant Chiplet Interconnect Technology
- Arteris Selected by GigaDevice for Development in Next-Generation Automotive SoC With Enhanced FuSa Standards
E-mail This Article | Printer-Friendly Page |