Intel 3 Represents an Intel Foundry Milestone
By Jim McGregor, Tirias Research
EETimes (June 18, 2024)
At the 2024 IEEE Symposium on VLSI Technology & Circuits in Hawaii, Intel provided details of the Intel 3 semiconductor process node, the third of five nodes in four years promised under CEO Pat Gelsinger’s IDM 2.0 manufacturing strategy. Intel 3 represents a major step in the Intel Foundry strategy as the first advanced process node joining the Intel 16 mature process node and a precursor to Intel’s angstrom process nodes: Intel 20A and Intel 18A.
These latter process nodes introduce gate-all-around (or what Intel calls RibbonFET) technology, and backside power delivery (or PowerVia) while returning Intel to the forefront of semiconductor manufacturing. These middle process nodes have been viewed by many as just subnodes introducing simple process enhancements. But as Intel demonstrated in a paper at the IEEE Symposium, Intel 3 represents a full node transition in terms of technology and performance efficiency that will benefit both Intel and the rest of the industry.
E-mail This Article | Printer-Friendly Page |
Related News
- QuickLogic Joins Intel Foundry Accelerator IP and USMAG Alliance Programs
- Kevin O'Buckley to Lead Foundry Services at Intel
- Omni Design Technologies Joins Intel Foundry Accelerator IP Alliance
- Intel Outlines Financial Framework for Foundry Business, Sets Path to Margin Expansion
- Flex Logix Joins Intel Foundry USMAG Alliance
Breaking News
- Faraday Joins Intel Foundry Accelerator Design Services Alliance to Target Advanced Applications
- Tenstorrent To Offer AI Workstation For Developers
- Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity
- FortifyIQ Introduces FortiPKA-RISC-V: A Breakthrough in Public Key Cryptography Acceleration
- M31 Debuts at the North American Design Automation Conference, Showcasing IP Solutions for Advanced Processes
Most Popular
- Siemens and Intel Foundry collaborate to deliver new tools certifications and EMIB/3D-IC innovation
- Tenstorrent To Offer AI Workstation For Developers
- ESWIN Computing Pairs SiFive CPU, Imagination GPU and In House NPU in Latest RISC-V Edge Computing SoC
- Cadence Expands System IP Portfolio with Network on Chip to Optimize Electronic System Connectivity
- X-Silicon Introduces the World's First Vulkan Driver Implementation for RISC-V, Enabling an entire Ecosystem of 3D Graphics, AI and Compute for Low-Power, Mobile, Edge and IOT Devices