NVM OTP NeoBit in GLOBALFOUNDRIES (350nm, 250nm, 180nm, 160nm, 150nm, 130nm, 110nm, 65nm, 55nm)
DSP Group to license Siliver baseband processor next-generation GSM handsets
![]() |
DSP Group to license Siliver baseband processor next-generation GSM handsets
By Semiconductor Business News
July 13, 2001 (1:19 p.m. EST)
URL: http://www.eetimes.com/story/OEG20010713S0052
SANTA CLARA, Calif. -- DSP Group Inc. here announced it will license a combination baseband processor/radio-frequency (RF) core for next-generation handsets based on the global system for mobile communications (GSM) standard. Co-Developed by DSP Group and a French design house called Stepmind, the Silver-1 core enables systems manufacturers to build a dual-mode handset based on the GSM/GPRS/EDGE standards. Silver-1 will not be sold as a standard product. Instead, the chip will be licensed to OEMs and chip makers. The chip combines Stepmind's RF chip and DSP Group's most advanced digital signal processor (DSP), dubbed the PalmDSPCore. Supporting wireless data rates up to 248-kilobits-per-second, the Silver-1 is designed for Class 12 GSM/GPRS/EDGE applications.
Related News
- CEVA Powers DSP Group's Next-Generation Ultra-Low-Power Always-On Voice Processor
- Mindspeed 3G/4G/LTE Baseband Solution Deploys CEVA DSP Processor to Deliver Best-in-Class Performance for Next-Generation Base Stations
- Toshiba Selects Cadence Tensilica Vision P6 DSP as Image Recognition Processor for its Next-Generation ADAS Chip
- Cadence Launches Next-Generation Tensilica High-Performance ConnX Baseband DSP Family
- Huawei Adopts Target's IP Designer Tool-Suite to Build Next-Generation Baseband DSP
Breaking News
- intoPIX Powers Ikegami's New IPX-100 with JPEG XS for Seamless & Low-Latency IP Production
- Tower Semiconductor and Alcyon Photonics Announce Collaboration to Accelerate Integrated Photonics Innovation
- Qualcomm initiates global anti-trust complaint about Arm
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- SiliconIntervention Announces Availability of Silicon Based Fractal-D Audio Amplifier Evaluation Board
Most Popular
- Qualcomm initiates global anti-trust complaint about Arm
- Siemens acquires Altair to create most complete AI-powered portfolio of industrial software
- Alphawave Semi Reveals Suite of Optoelectronics Silicon Products addressing Hyperscaler Datacenter and AI Interconnect Market
- EnSilica Agrees $18m 7 Year Design and Supply ASIC Contract
- Rapidus Announces Strategic Partnership with Quest Global to Enable Advanced 2nm Solutions for the AI Chip Era
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |