Rambus Elects Harold Hughes to its Board of Directors
LOS ALTOS, CA -- June 5, 2003 -- Rambus Inc. (Nasdaq:RMBS), a leading provider of chip-to-chip interface products and services, today announced it has elected Harold Hughes to its board of directors. Mr. Hughes brings 26 years of experience in the finance and corporate planning arena to Rambus' board. Mr. Hughes served as a United States Army Officer from 1969 - 1974 before starting his private sector career with Intel Corporation. Mr. Hughes held a variety of positions within Intel Corporation from 1974 - 1997, including treasurer, vice president of Intel Capital, chief financial officer, and vice president of Planning and Logistics. Following Intel, Mr. Hughes was the chairman and CEO of Pandesic LLC, an Intel and SAP joint venture.
"Rambus is an exciting company to be involved with due to the stellar management team and the strong engineering talent," said Harold Hughes. "This unique combination allows Rambus to create the world's fastest chip-to-chip interface solutions and deliver these solutions to the market."
In addition to serving on Rambus' board, Mr. Hughes also serves on the boards of London Pacific, Merant, and Atsana. Mr. Hughes holds a BA from the University of Wisconsin and an MBA from the University of Michigan.
About Rambus Inc.
Rambus is a leading provider of chip-to-chip interface products and services. The company's breakthrough technology and engineering expertise have helped leading chip and system companies to solve their challenging I/O problems and bring industry-leading products to market. Rambus' interface solutions can be found in numerous computing, consumer electronic and networking. Additional information is available at www.rambus.com
|
Related News
Breaking News
- Siemens delivers certified and automated design flows for TSMC 3DFabric technologies
- AheadComputing Raises $21.5M Seed Round and Introduces Breakthrough Microprocessor Architecture Designed for Next Era of General-Purpose Computing
- ZeroPoint Technologies Unveils Groundbreaking Compression Solution to Increase Foundational Model Addressable Memory by 50%
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Veriest Solutions Strengthens North American Presence at DVCon US 2025
Most Popular
- Intel in advanced talks to sell Altera to Silverlake
- S2C Teams Up with Arm, Xylon, and ZC Technology to Drive Software-Defined Vehicle Evolution
- Siemens to accelerate customer time to market with advanced silicon IP through new Alphawave Semi partnership
- Breker RISC-V SystemVIP Deployed across 15 Commercial RISC-V Projects for Advanced Core and SoC Verification
- Arteris Revolutionizes Semiconductor Design with FlexGen - Smart Network-on-Chip IP Delivering Unprecedented Productivity Improvements and Quality of Results
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |