Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
By Alan Patterson, EETimes (July 16, 2024)
Samsung has slowed the ramp of its new fab in Taylor, Texas, despite the Department of Commerce (DoC) conditionally awarding the company a $6.6 billion stimulus package under the CHIPS Act. The DoC told EE Times that the subsidies for Samsung and other CHIPS Act winners are not final yet.
On April 15, the DoC and Samsung signed a non-binding agreement providing up to $6.4 billion in direct funding under the CHIPS Act to help revive chipmaking in the U.S. During a quarterly results announcement on April 30, Samsung said that it delayed the production start for the Taylor fab project from the second half of 2024 to “maybe 2026.”
![]() |
E-mail This Article | ![]() |
![]() |
Printer-Friendly Page |
Related News
- Samsung Selects Texas as Site for $17 Billion Fab
- Samsung to spend $1.9 billion on logic fab, says report
- IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
Breaking News
- Q2 2024 Global Semiconductor Equipment Billings Increased 4% Year-Over-Year, SEMI Reports
- CAST Ships I2C/SPI Controller IP Core for Easier Serial Communication
- GUC Monthly Sales Report - August 2024
- UMC Reports Sales for August 2024
- CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices
Most Popular
- Blue Cheetah Collaborates with LG to Demonstrate Successful Silicon Bring-Up of Chiplet-Based Design
- SiliconAuto adopts Siemens' PAVE360 to accelerate pre-silicon ADAS SoC development
- Intel considers foundry split, fab cancellations
- CoreHW and Presto Engineering Announce Ground-breaking Collaboration to Advance Global Penetration of Ultra-low-power RF IoT Devices
- Global Semiconductor Sales Increase 18.7% Year-to-Year in July